As an Senior Member of Technical Staff or Distinguished Member of Technical Staff in Advanced Packaging Technology Development, you will be a technical leader in Micron’s Advanced Packaging strategy and drive technical innovation and engagement with both internal and external customers to enable a best-in-class product roadmap enabled by innovative and industry leading memory and heterogenous integrated packaging solutions.  

You will have the opportunity to collaborate with the industry leading technologists at partners engaged in advancing High Performance Computing and AI solutions that require memory and logic architectures and packaging technology that offers differentiated performance.   

You will collaborate with Micron’s world-wide talent that include front end silicon development, product and system engineering, high volume manufacturing operations.  

In this role, you will directly interact with senior executives on the technology which enables product plans and how to enable it. Together, we will be responsible for the definition, development, and delivery of state-of-the-art products that will advance compute and shape the future of this planet and beyond. 

You must be comfortable and adept at dealing with uncertainty and find ways to identify and establish value, understand challenges and work across domain expertise, and across functions to convert challenges from “cannot do” to “can do”, and conversations from “can do, but” to “and, can do” through analysis, developing a strategy, educating, garnering support and driving execution. 

Responsibilities will include, but are not limited to: 

• Develop and maintain strong relationships and understanding of what technical solutions would enable our customers from an interconnect, packaging and cost-effective product solution. 

• Drive development of technical solutions with SoC architects, silicon design, and product teams to recommend the optimum package solutions to meet electrical, mechanical, thermal, and other system level requirements. Introducing novel solutions at appropriate points to enable these solutions. 

• Enable package design and assembly of advanced 2.5D/3D packages, through selection of materials, body sizes, tooling requirements, process capability evaluation and improvement, and package constructions to achieve acceptable Design for Manufacturing and High-Volume Manufacturing cost and efficiency requirements. 

• Interface closely with Micron’s internal manufacturing and external partners to productize advanced packaging solutions from concept to prototyping, testing and sample delivery to mass production phases. 

• Support and collaborate with customers to ensure that Micron’s products can meet their quality, reliability, system, and operational needs. 

Successful candidates for this position will have: 

• An established network with peers in the industry and relationships with key stakeholders  

• Proven ability to drive packaging roadmaps, engage vendors and suppliers and support business unit leaders in customer engagements. 

• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical stakeholders. 

• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures.  

• Experience with wafer bumping, wafer bonding, package assembly, substrate technology, BOM selection, testing and product development lifecycle. 

• Strong publication record, patents, or contributions to industry standards are highly desirable. 

• Demonstrated leadership experience in guiding cross-functional teams and driving technical excellence. 

Required Experience: 

• Bachelor/Master of Science in materials, mechanical, chemical, or electrical engineering. MS or PhD preferred. 

• 10+ years of relevant experience