Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY22 and approximately 25,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible.

We are seeking a talented and experienced wire bonding process engineer to join Assembly Process engineering team.

Key Responsibilities:

Process Development and Optimization:

• Develop and optimize wire bonding processes for new and existing semiconductor packages (SIP, BGA,  flat packages: QFN,DFN, small package outline: QSOP, MSOP, etc. ) and ensure seamless transfer to manufacturing
• Perform process characterization, validation and optimization to enhance yield, reliability, productivity and cost-effectiveness.
• Perform Design of Experiments and statistical analysis to optimize wire bonding parameters.
• Evaluate and select wire bonding equipment and materials based on performance and cost-effectiveness.
• Develop, sustain and revise process documentation (specifications, procedures, and work instructions).

Problem Solving and Continuous Improvement:

• Investigate and resolve process-related issues and customer complaints with strong analytical skill (Root cause analysis) and provide corrective actions.
• Drive continuous improvement initiatives to enhance process capabilities, yield, productivity, and quality.
• Perform failure analysis and troubleshoot issues related to wire bonding processes.
• Capable to participate in the new product development and provide input on technical challenges.

Collaboration and Cross-Functional Support:

• Collaborate with design, manufacturing, quality, and supply chain teams to ensure seamless integration of wire bonding processes.
• Support new product introduction (NPI) by developing wire bonding solutions tailored to specific product requirements.
• Take ownership to work with cross functional team to resolve complex technical problems.
• Interface with equipment vendors and materials suppliers to evaluate new technologies and materials for wire bonding for yield, productivity, and cost-effectiveness.

Training and Development:

• Provide technical training and support to young engineers and manufacturing teams on wire bonding processes and equipment.
• Drive training, equipment and manufacturing team to foster best known method (BKM) for wire bonding process enhancement.
• Stay current with industry trends and advancements in wire bonding technologies and materials.
• Provide technical expertise and support to manufacturing operations.

Required Qualifications:

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical, Chemical or related field.
• Well experience (2-5 years) in wire bonding processes within the semiconductor industry or similar field.
• In-depth knowledge of wire bonding techniques, equipment (Ball bonders) and materials (Gold, Copper wire).
• Excellent communication skills and ability to collaborate effectively as a team.
• Ability to work independently and manage multiple priorities effectively.
• Experience with automated wire bonding equipment and processes.
• Experience in new product introduction (NPI) and process development.
• Six Sigma or Lean Manufacturing certification (Preferred)

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export  licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.  As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

Job Req Type: Experienced

          

Required Travel: No

          

Shift Type: 1st Shift/Days