Posted:
9/16/2025, 5:41:16 PM
Location(s):
Kedah, Malaysia
Experience Level(s):
Junior ⋅ Mid Level
Field(s):
Mechanical Engineering
Workplace Type:
On-site
Performs electrical or mechanical troubleshooting to determine problems in nonfunctioning equipment used in the manufacturing process.
Dismantles, adjusts, repairs, and installs/assembles equipment according to layout plans, blueprints, operating or repair manuals, and rough sketches or drawings.
Performs setup, calibration, and preventative maintenance on production equipment, and coordinates with supplier for service and repairs where needed. Monitors and analyzes all related data to improve and maintain tool performance and address all tool/module related issues.
Creates reports of system failures, updates existing specs, and creates new specs that supports overall equipment maintenance/performance.
Works with Module Engineering to execute experiments and equipment configuration changes, supports data collection activities, and generally completes tasks per published procedures.
Supports Engineering with module equipment troubleshooting through data analysis and controlled experimentation that will meet or improve module availability and performance targets preventing future excursions.
During factory ramps, works with module engineering and construction teams to ensure tools are installed and/or converted per designs.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.Website: https://www.intel.com/
Headquarter Location: Santa Clara, California, United States
Employee Count: 10001+
Year Founded: 1968
IPO Status: Public
Last Funding Type: Post-IPO Equity
Industries: Artificial Intelligence (AI) ⋅ Information Technology ⋅ Product Design ⋅ Semiconductor ⋅ Software