Come join Analog Devices (ADI) – a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare.

ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future. 

ADI At A Glance

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY23 and approximately 26,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible. Learn more at www.analog.com and on LinkedIn.

          

Job Description:

This role involves developing advanced packaging solutions for semiconductor devices across various market segments in the wafer level packaging domain. These packaging solutions must meet demanding product requirements while balancing reliability and cost-effectiveness. Candidates will be expected to:

• Experience and working knowledge with wafer level chip scale packaging and 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures.
• Work with cross-functional team to develop these aforementioned packaging solutions that include design, material selections, qualification, and release-to-manufacturing for various product groups.
• Work with the quality and reliability groups to establish the reliability criteria for semiconductor products going into various markets.
• Manage qualifications activities, document process flows and control plans for electronics packages at company’s external suppliers.
• Perform component or system level mechanical stress and thermal simulations.

Qualifications:

• Minimum of a Master’s degree in Mechanical or Materials Engineering.
• Knowledge of  Wafer Level and Die Level 2.5D and 3D Heterogenous Package Technologies.
• Good understanding of IC packaging materials and their behaviors.
• Experience with AutoCAD and SolidWorks is a plus.
• Prior internship experience in semiconductor IC or electronics assembly would be a distinct advantage.
• Strong organizational and communication skills.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export  licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.  As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Graduate Job

          

Required Travel: Yes, 10% of the time