Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR60327 Engineer Package Design

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Are you enthusiastic about semiconductor package design and would you enjoy being part of a global team of experts? Then apply for the Senior Package Design Engineer position in the Global Design, Simulation, and Substrate team at Micron Technology.
You will collaborate with global multi-functional teams to provide innovative DRAM package design solutions for various applications such as Mobile, Edge/Cloud Computing, Automotive, Artificial Intelligence, and Data Center.
Deliver design activities on time and ensure that design outputs meet Assembly and vendor specifications. Join global multi-functional teams, including internal assembly sites, and external subcontractors, to deliver package designs optimized for requirements such as electrical (signal and power integrity), mechanical (warpage, package strength), thermal, and reliability requirements for high-speed interfaces. The results include substrate design databases, package stack-up, routing studies, substrate layout, wire bond diagrams, simulation, and other design documentation.
Collaborate with engineering teams--Technology Development (TD), Package Architecture, and key customers in defining next generation packaging solutions and recommend design rules and capability advancements required to productize solutions as roadmap offerings.

Responsibilities will include, but are not limited to:

• Package design execution of DRAM designs on time with 100% quality.
• Support design of highly integrated packages for optimal electrical performance, manufacturability, and reliability and to reduce Turnaround time. Work with customers, internal process design teams, OSATs, and other ecosystem partners.
• Driving innovations into the future memory generations within dynamic work environment.
• Support set up of designs, rules, and routing methodologies for advanced processes.
• Support package and DFMEA reviews with assembly engineering and subcon teams.
• Generate and update assembly documents in database. Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings.
• Work with SBT (Printed Circuit Board) suppliers, OSATs (Outsourced Semiconductor Assembly and Test), and other ecosystem partners to meet their requirements with packaging solutions.
• Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.
• Support a data driven culture, operational excellence and establishing processes and operational metrics.
• Lead package and DFM (Design for Manufacturing) reviews and design setup.
• Engage with key Business Unit (BU) customers and assembly subcontractor partners to propose package solutions that meet customer and/or market needs.
• Support package technology development, including material selection, process development, DOEs (Design of Experiments), and related activities.
• Track and drive program landmarks to ensure timely development execution.
• Support packaging IP (Intellectual Property) development.
• Provide design support for thermal/mechanical/electrical simulation analysis.
• Support and supply to the design group’s continuous improvement efforts such as:
  • Global design alignment activities
  • Package design rules and system development
  • Package roadmaps
  • Competitive Analysis review

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.