Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY22 and approximately 25,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible.

Descriptions

This position is within Global Operations and Technology organization. This position is responsible for leading the technology development and manufacturing of Packaging Solution for sensing and/or high frequency RF module devices. The senior engineer in this role is required (1) to work cross-functionally with business units, product designers, US-based and Asia-based manufacturing, reliability teams; and (2) to determine SiP solutions that considers optimal tradeoffs between cost, reliability, and time-to-market while meeting product-level performance requirements.

Role’s Functional Activities

• Functional ownership of IC package design and assembly processes at different phases of product development from design engineering, prototypes, sampling, reliability stress testing, and release-to-manufacturing
• Manage the package development through mechanical design, package or substrate layout/simulation, process/materials development, and assembly of engineering and qualification samples.
• Design and develop integrated SiP solutions based on multi-layer organic substrates with Wirebond and advanced Flip Chip interconnects.
• Leveraging existing solution or developing more advanced solutions based of unique product needs
• Project management with offshore resident engineering teams and internal product development teams that include product designers, marketing, quality, and reliability engineering
• Support cross-functional problem solving using DOEs, DFMEAs, and 8D methodologies.

Key Requirements

• Minimum of Master’s in engineering, mechanical or manufacturing related with up to 3 years of industry experience.
• Excellent verbal and communication skills due to cross-functional nature of role
• Preference to candidates with experience in semiconductor packaging and assembly processes that includes flip chip bumping, wirebond interconnections, package substrate technologies, underfilling, cavity-style packages technologies.
• Demonstrated experience of working with engineering teams from different cultures in global environment.
• Able to demonstrate strong engineering aptitude with excellent problem-solving skills during selection process
• General awareness of FEA-based analysis techniques as related to SiP package designs would be distinct advantage

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export  licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.  As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Experienced

          

Required Travel: Yes, 10% of the time

          

Shift Type: 1st Shift/Days