Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY23 and approximately 26,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible. Learn more at www.analog.com and on LinkedIn.

          

The Chip Package Systems Engineering group in Engineering Enablement is looking for a talented and motivated mechanical engineer to join our dynamic engineering team. If you're passionate about semiconductor packaging, mechanical design, and stress simulation, this is an exciting opportunity to grow and make a meaningful impact in a rapidly evolving industry.

As a Mechanical Engineer you will be focusing on Semiconductor Packaging & System Level Stress and Thermal Simulations. You will be part of a team responsible for developing robust and reliable packaging solutions for semiconductor devices and systems. You will work closely with senior engineers to design, simulate, and analyze mechanical structures for advanced semiconductor packaging, with a focus on optimizing for mechanical stress, thermal management, and long-term reliability.

Your responsibilities will include performing stress simulations, designing test structures, collaborating in product development cycles, and applying engineering principles to solve real-world challenges in semiconductor packaging and system level problems.

What You'll Do:

• Stress & Thermal Simulations:
  • Run mechanical and thermal simulations (thermal stress, shock, vibration) using FEA tools to predict semiconductor package performance.
  • Analyze results and collaborate with design teams to improve package reliability.
  • Develop and validate test procedures to confirm simulation accuracy.
  • Perform 3D simulations to assess temperature distribution, thermal gradients, and stress concentrations.
  • Use simulation software (e.g., ANSYS, COMSOL, SolidWorks) to model packaging behavior.
  • Conduct stress analysis, including thermal cycling, to predict failure modes like warping, cracking, or delamination.
• Semiconductor Packaging Analysis & Co-design:
  • Assist in the design, analysis, and development of semiconductor packaging solutions, including materials selection, thermal management, and mechanical performance.
  • Conduct simulations and analyses to assess mechanical stress, thermal behavior, and potential failure points of packaging structures.
  • Collaborate with cross-functional teams to integrate packaging solutions into system-level designs and optimize structures, materials, and interfaces for improved performance and reliability.
  • Support the design and development of packaging solutions for semiconductor devices to validate designs and ensure mechanical stability and thermal efficiency under real-world conditions.
• Collaborative Engineering:
  • Partner with electrical engineers, packaging specialists, and product teams to deliver optimal solutions for complex system integration and performance.
  • Act as a technical resource for manufacturing teams, providing design input to improve efficiency and address production challenges.
  • Support reliability testing efforts, including thermal cycling, shock, and vibration testing, to validate simulations and ensure long-term performance.
  • Support the design and development of test setups to monitor the mechanical and thermal performance of prototypes.
• Documentation & Communication:
  • Prepare and present technical reports on simulation results, design changes, and test outcomes to management and cross-functional teams.
  • Stay up to date on industry trends and tools, while enhancing skills through ongoing training and workshops.
  • Maintain clear and detailed records of engineering design processes, test results, and simulations for future reference.

Who You Are:

• Educational Background:
  • Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, or a related field.
  • Coursework and academic projects related to semiconductor packaging, mechanical stress analysis, and thermal management are pluses.
• Experience:
  • 1–5 years of experience in semiconductor packaging, stress, and thermal simulations.
  • Proficient in FEA tools (e.g., ANSYS, COMSOL, Abaqus) for modeling mechanical and thermal systems.
  • Experience performing thermal management in small-scale devices, understanding materials like thermal interface materials (TIMs), heat sinks, and substrates.
  • Familiarity with thermal management techniques, package-level stress analysis, and semiconductor packaging methods (e.g., flip-chip, BGAs, CSPs).
• Skills & Knowledge:
  • Proficient in simulation software (e.g., ANSYS, SolidWorks, COMSOL, MATLAB) and 3D thermal/mechanical simulations for optimizing package and system-level designs. Experience with CAD software (e.g., SolidWorks, AutoCAD) is a plus.
  • Strong understanding of semiconductor packaging technologies (e.g., flip-chip, wire bonding, BGA, FOWLP) and thermal management strategies (e.g., heat sinks, thermal vias, substrate materials).
  • Solid knowledge of materials science (polymeric, ceramic, metal) applied to semiconductor packaging and reliability testing (thermal cycling, vibration, shock).
  • Excellent analytical, problem-solving, and communication skills for translating simulation results into actionable design improvements.
• Other:
  • Ability to work effectively both independently and in a team environment.
  • Willingness to learn new technologies and methods in a fast-paced environment.
  • Enthusiasm for working in the semiconductor industry and contributing to innovative solutions.
  • Strong written and verbal communication skills, with the ability to explain complex technical concepts to both technical and non-technical audiences.
• Preferred Experience:
  • Internship or hands-on experience in mechanical stress simulation or semiconductor packaging.
  • Familiarity with materials science for semiconductor packaging, including mechanical and thermal properties of materials like silicon, epoxy, copper, and solder.
  • Knowledge of reliability testing methodologies (thermal cycling, drop testing, shock testing) and stress failure modes (delamination, warpage, cracking).
  • Experience with multi-physics simulations (mechanical, thermal, and electrical analysis) and advanced packaging technologies (e.g., FOWLP, 3D-IC packaging).

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export  licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.  As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Experienced

          

Required Travel: Yes, 10% of the time

          

Shift Type: 1st Shift/Days

The expected wage range for a new hire into this position is $107,200 to $147,400.

• Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.

• This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.

• This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.