RELOCATION ASSISTANCE: Relocation assistance may be available

CLEARANCE TYPE: Secret

TRAVEL: Yes, 10% of the Time

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative 1st Shift Physical Vapor Deposition (PVD) Process Engineer for our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland - where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs.

Northrop Grumman’s ATL semiconductor foundry is a unique capability supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, and Silicon Carbide) and providing leading edge technology development in superconducting electronics. Our devices enable a number of Northrop Grumman’s ground based radars, avionic radars, and space systems.

Join us for the chance to work with an amazing, experienced, and talented team while helping serve your country. Enjoy the opportunity to grow and learn with a variety of challenging projects in R&D, ongoing long term programs, and new programs targeting future military platforms.

Our multidisciplinary foundry team enables activities from development to sustainment process engineering. ATL is responsible for all aspects of semiconductor technology including design, mask making, wafer fabrication, test, and assembly. The candidate must be a strong team participant, have excellent communication skills, and be resourceful and multitalented. A strong understanding of semiconductor technology, metrology processes, and equipment engineering is essential.

The 1st shift PVD Process Engineer should demonstrate an ability to communicate well with others and work equally well independently and as part of a team.

The 1st shift PVD Process Engineer will be responsible for but not limited to:

•  All aspects of sustaining PVD processes for semiconductor manufacturing.  This includes process qualifications, technician training and certification, and process safety

•  Interfacing with other unit process engineers and product integration engineers to develop processes to support emerging technologies

•  Supporting statistical process control (SPC) and continuous improvement efforts 

•  Establishing and sustaining standard operating procedures and engaging the operations team to ensure these are followed

•  Creating and maintaining process documentation

•  Performing all other related duties as assigned

#NGATL

This requisition maybe filled at either the Principal Physical Vapor Deposition (PVD) Process Engineer or Senior Principal Physical Vapor Deposition (PVD) Process Engineer

Basic Qualifications for Principal Physical Vapor Deposition (PVD) Process Engineer:
•    Bachelors in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or closely related discipline with 5 years technical related experience in semiconductor fabrication, or Master’s Degree with 3 years’ experience; PhD with 0 years experience
• Hands-on experience with evaporators and / or sputtering equipment from OEMs like CHA Industries, KDF, Materials Research Corp., Temescal, PERKIN-ELMER, and Applied Materials, Inc. (AMAT)

• Direct experience with semiconductor fabrication and working in a cleanroom environment
• Must possess good interpersonal and communication skills, both written and verbal, problem solving skills with ability to work with a diverse group of people including technicians, engineers and management

• Must be able to work a large percentage of time in a Class 100 cleanroom environment and be able to meet all physical and PPE requirements

•  Ability to obtain and maintain Secret clearance
•  Must be a US citizen

Basic Qualifications for Senior Principal Physical Vapor Deposition (PVD) Process Engineer:
•  Bachelors in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or closely related discipline with 8 years technical related experience in semiconductor fabrication; Master’s degree with 6 years of experience; or PhD with 3 years of experience
• Hands-on experience with evaporators and / or sputtering equipment from OEMs like CHA Industries, KDF, Materials Research Corp., Temescal, PERKIN-ELMER, and Applied Materials, Inc. (AMAT)

• Direct experience with semiconductor fabrication and working in a cleanroom environment 

• Must possess good interpersonal and communication skills, both written and verbal, problem solving skills with ability to work with a diverse group of people including technicians, engineers and management

• Must be able to work a large percentage of time in a Class 100 cleanroom environment and be able to meet all physical and PPE requirements

•  Ability to obtain and maintain Secret clearance
•   Must be a US citizen

Preferred Qualifications:
•    Experience with statistical process control (SPC)
•    Experience in lean manufacturing practices and structured problem-solving methodology, DOEs, RCCA.
•    Familiar with various software packages commonly found in Semiconductor Wafer Fabs – EMS Systems (FactoryWorks or alike systems), statistical analysis tools – SPACE, JMP, Minitab, etc.
#NGMCFab

Salary Range: $105,400.00 - $158,000.00Salary Range 2: $131,100.00 - $196,700.00

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.