About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
 

Summary of Role:

The GlobalFoundries Field Application Engineering is at the tip of the spear, responsible for the early technical sales engagement to assess customer technical needs and identify the best GF technical solution to satisfy those needs.  The TPS should understand and surmount any barriers of adoption the client may have for using GF technologies for their product developments.  TPS will work cross functionally with internal GF technical experts in pursuit of these design win opportunities. 

Work Location: Near one of our office locations is preferable but open to hybrid work or remote locations within the US.
 

Essential Responsibilities:

• Engage with customers to understand their technical needs towards development of their semiconductor IC products. 

• Assess the competitive landscape to identify and advocate winning GF value propositions. 

• Partner internally with GF account managers, product marketing, and technical experts in the creation of compelling, application specific presentations to describe how GF technology solutions can help those customers develop their industry winning products. 

• Work closely with the account management team to merge technical and commercial terms into a design winning proposal.

• Where competitive gaps exist, advocate internally for improved features and capabilities of GF solutions to close such gaps.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
   

Required Qualifications:

• Education – Bachelors or Masters degree in electrical engineering or equivalent (e.g. applied physics, etc). 

• Experience – Minimum 5 yrs in semiconductor product design at the chip or module level. 

• Skills – Working knowledge of IC chip design flows and tools from architectural definition through performance characterization.  Active thinking, positive attitude, problem solving, strong responsibility and ownership, teamwork and personal communication skills are critical.

• Travel - Up to 20%, primarily domestic with some international travel.

• Fluency in English Language – written & verbal

Preferred Qualifications:

• Education – Master’s or PhD in electrical engineering or equivalent. 

• Experience - 10 yrs in semiconductor product design at the chip or module level. 

• Skills - Direct experience in IC chip design flows and tools from architectural definition through performance characterization. 

• Exposure/Experience in one or more of Digital / Analog Mixed Signal/HV Power/eNVM/Millimeter Wave/Silicon Photonics IC product design highly desirable

• SoC product integration/design experiences highly desirable.

• Customer facing, application engineering experience highly desirable. 

• Direct automotive chip/system design experience highly desirable

• Experience in semiconductor manufacturing a plus. 

• Foundry integration, technology development highly desirable

• Project management skills and demonstrated ability to innovate and execute on solutions that matter.

• The ability to navigate ambiguity.

• Strong planning & organizational skills.

• Strong communication and presentation skills.

Expected Salary Range

$138,000.00 - $221,500.00

The exact Salary will be determined based on qualifications, experience and location.