Principal Engineer, PDE Frontier Materials & Package Characterization

Posted:
1/18/2024, 4:00:00 PM

Experience Level(s):
Expert or higher ⋅ Senior

Field(s):
Mechanical Engineering

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR44530 Principal Engineer, PDE Frontier Materials & Package Characterization

As a PDE Principal engineer of Frontier Materials & Package Characterization Engineering, you will be primarily responsible for defining, pathfinding and explore new materials for Micron future market segments in AI, Immersion cooled and cryogenic memory high-performance computing. This includes to improve packaging quality and reliability, working on frontier materials characterization methodology, benchmarking on new test methodologies, and materials reliability risk management. You will also be required to identify, diagnose, and resolve potential new failure mechanisms with respect of each new frontier materials introduced by applying failure analysis, and some mechanical characterization methodology. Additional responsibilities include enabling new Characterization lab CAPEX and benchmarking external lab capabilities benchmarking and material evaluation/optimization to assess risks especially in those changes at assembly process step, leading and participating in cost reduction activities, handling new process baseline characterization, and liaising with material suppliers to achieve quality, cost and risk management objectives.

Responsibilities

  • Responsible for pathfinding of new frontier materials used in future Micron market segments such as AI, IoT and high-performance computing used in Quantum computing, future immersion-cooled datacenter applications, electric flight/ hybrid flight, space explorations.
  • Be the overall leader in driving discussion with packaging material suppliers in meeting new Micron materials specification and research roadmaps
  • Own and establish overall frontier projects in materials characterization, resource allocation
  • Collaborate with industrial alliances such as IEEE EPS technical section, ITRI, IMEC on materials, package, and new testing methodologies
  • Lead in PDE technical seminar initiatives, executive summary for frontiers materials sharing and industrial collaborations
  • Liaise with Asia university professors (Taiwan, Singapore, Malaysia, and India) and industrial Consortia in US for invited distinguished speaker opportunities and technical seminar collaborations in cryogenic memory and heterogenous integration roadmaps
  • Plan out executive summary tracking and forecasting by quarters
  • Be the Point-of Contact pertaining to all aspects of assigned products/packages in relating to new materials development engineering
  • Develop strategies to drive frontiers materials roadmaps & initiatives

Requirements

  • PhD in Electronics/ Mechanical/ Chemistry/ Physics/ Materials/ Chemical Engineering
  • Highly motivated individuals with 8+ years of relevant working experience are encouraged to apply
  • Possesses technical and people management experience in package development is a plus
  • Familiar and well-versed in component level, board level packaging and/or materials characterization
  • Experience and familiar with industrial Consortia such as IEEE/ JEDEC/ SEMI Technical Conferences and Seminars
  • Preferably candidate/s with IEEE conference paper publication, patent filing and journal publication
  • Good understanding of package reliability testing and material science
  • A team player equipped with excellent interpersonal and communication skills.
  • Possess initiative and ability to work independently.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at [email protected].

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Micron Technology

Website: https://micron.com/

Headquarter Location: Boise, Idaho, United States

Employee Count: 10001+

Year Founded: 1978

IPO Status: Public

Last Funding Type: Post-IPO Equity

Industries: Computer ⋅ Hardware ⋅ Manufacturing ⋅ Semiconductor