Package Reliability Engineer

Posted:
6/12/2024, 5:00:00 PM

Location(s):
Taichung, Taichung City, Taiwan ⋅ Taichung City, Taiwan

Experience Level(s):
Junior ⋅ Mid Level ⋅ Senior

Field(s):
Software Engineering

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR51751 Package Reliability Engineer

As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., we are primarily responsible for package quality and reliability for Micron’s product lines working end to end for DRAM and Module qualification, provide inputs and approve phase gates, HVM monitoring and dispositions.

This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced and providing recommendations on product release based on reliability test results.

We will also be encouraged to devise reliability test plans to assess risk associated with excursions, conversions, reliability and qualification issues. We will coordinate root cause and corrective action efforts within the GQ department for package related qualification failures and RMA (Returned Material Authorization) and prepare reports for discussion. We also engage in phase gate review starting from design to production release and ensure CTQ compliance and inline validation. Additional duties include providing support to internal and external customers for package-related issues, and customer requests. HVM reliability monitoring would be a key responsibility for this role which require day to day planning, execution, risk assessment and disposition.

Successful candidate for this position will have:

  • Detailed knowledge of semiconductor component package assembly processes and challenges
  • Knowledge of surface mount processes and challenges
  • Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies
  • Good understanding of the effects thermo-mechanical, thermal, mechanical, and hygroscopic swelling stresses on package reliability
  • A proven understanding of industry standard reliability test methods, acceleration models used for life predictions, and sampling statistics preferred.
  • Must be self-motivated, able to work independently, and detail oriented.
  • Strong analytical problem-solving skills, excellent multi-tasking skills and the ability to interact easily with other groups.
  • Good written and interpersonal skills, digital literacy are vital. proven understanding of the software systems employed in backend manufacturing and analytics is a plus like MAM, MES, JMP, Tableau etc.

Education and Experience:

  • Minimum of BS degree, and equivalent degree in Engineering (Electronics, Mechanical, Materials) or related field of study.
  • Master’s degree in science (physics, statistics) and Engineering (Electronics, Mechanical, Materials) will be considered as well.

Qualification and Skills:

  • Knowledge in Micro Electronic Packaging, Quality and Reliability Engineering and Failure Analysis are preferred.
  • Knowledge of materials properties, applications, and materials characterization.
  • Experience in memory or related products in assembly, testing or reliability preferred.
  • Experience in data analysis and reliability modelling will be preferred.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at [email protected].

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Micron Technology

Website: https://micron.com/

Headquarter Location: Boise, Idaho, United States

Employee Count: 10001+

Year Founded: 1978

IPO Status: Public

Last Funding Type: Post-IPO Equity

Industries: Computer ⋅ Hardware ⋅ Manufacturing ⋅ Semiconductor