This position is a 3 to 6 month Graduate-level Internship with the package and platform team at Rivos. You would be involved in all stages of the product development cycle - solution path finding, design implementation, OK2Fab sign-off, bring up, function and performance validation, troubleshooting, to mass production. The individual contributor in this role will drive package design, PCB design, and provide feedback to silicon development engineers from SIPI perspective. You would be a member of a dynamic team interacting with various key organizations across the company. Routine work includes detailed investigations into advanced packaging technology, passive component design optimization, analyzing and measuring component characteristics and modeling of channel components and utilizing channel statistical or transient simulators for channel signaling analyses.