Posted:
10/15/2024, 10:07:35 PM
Location(s):
Bangkok, Thailand
Experience Level(s):
Expert or higher ⋅ Senior
Field(s):
Mechanical Engineering
Description -
What a Packaging Design Engineer does at HP:
In this position you will design packaging for computer peripherals supporting video conferencing equipment.
The perfect candidate will have experience in designing cartons, rigid boxes, and molded pulp cushions.
Designs portions of engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with provided specifications and requirements.
Implements established test plans for existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, developing fan curves, system power measurements & acoustics.
Develops understanding of and relationship with internal and outsourced development partners on mechanical and thermal design and development.
Participates as a member of project team of other mechanical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for low to moderately-complex products.
Qualifications:
Bachelor's or Master's degree in Packaging Engineering, or any other related discipline or commensurate work experience or demonstrated competence.
10+ years experience.
Experience or understanding of 3D CAD software as a mechanical design tool.
Understanding of design for packaging and associated production tooling and processes.
Strong analytical and problem-solving skills, with the ability to identify process gaps and propose solutions.
Proficient in Microsoft Excel, PowerPoint and Teams and SharePoint.
Excellent communication and interpersonal skills, with the ability to collaborate effectively with cross- functional teams.
Detail-oriented and organized, with the ability to manage multiple tasks and meet deadlines.
Ability to work successfully in an environment with varying levels of complexity.
Responsibilities:
Leads multiple project teams and internal and outsourced development partners responsible for all stages of electrical packaging design and development for complex products, solutions, and platforms.
Conducts structural packaging qualification processes through rigorous drop and vibration testing as well as manufacturing process qualifications.
Expands relationships with internal and outsourced development partners on structural packaging design and development.
Reviews and evaluates designs and project activities for compliance with HP's General Standards for the Environment and sustainability guidelines and standards; provides tangible feedback to improve product quality.
Identify trends and opportunities for optimizing product product/solution output, quality enhancements and cost of delivery.
Provides packaging industry specific expertise and overall technical packaging design and manufacturing leadership and perspective to cross-organization projects, programs, and activities.
Develops cost estimates, business cases, appropriation requests and plans for packaging design projects.
Leads delivery professionally written reports, and supports realization of operational and strategic plans.
Drives innovation and integration of new technologies into projects and activities in the packaging design organization.
Provides guidance and mentoring to less- experienced staff members to set an example of packaging design and development, innovation, and excellence.
#Li-Post
Job -
EngineeringSchedule -
Full timeShift -
No shift premium (Thailand)Travel -
Relocation -
Equal Opportunity Employer (EEO) -
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
If you’d like more information about HP’s EEO Policy or your EEO rights as an applicant under the law, please click here: Equal Employment Opportunity is the Law Equal Employment Opportunity is the Law – Supplement
Website: http://www.hp.com/
Headquarter Location: Palo Alto, California, United States
Employee Count: 10001+
Year Founded: 1939
IPO Status: Public
Last Funding Type: Post-IPO Equity
Industries: Computer ⋅ Consumer Electronics ⋅ Hardware ⋅ IT Infrastructure ⋅ Software