Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron’s Assembly Package Technology Development team is looking for a motivated and experienced individual contributor in Process Development at our San Jose, California location.

As an Advanced Packaging Technology Development Engineer at Micron Technology, Inc, you will be developing, configuring and optimizing Package Assembly processes (front end, bonding and back end) for Micron’s memory products from pathfinding through NPI start up including side by side certification with Manufacturing teams.

Responsibilities:

• Assessing processes by knowledge and skills, taking measurements and interpreting data are everyday responsibilities and expectations for the successful candidate.
• Assembly design rules development working closely with Design teams (Globally) and be involved in the design approvals (substrate and silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board).
• An importance of this role is pathfinding of innovative package technology: Deep fundamental understanding of key risks in Bumping, Flip chip and HBM technologies.
• Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount is a plus.
• Hands on integration experience in Package Assembly and Wafer Level package process are needed. 
• Other responsibilities may include conducting supplier interactions/meetings and drive NDAs for new projects, which all together requires a significant understanding processes, first principles and process control systems.

Minimum Qualifications:

• 3 years minimum experience in semiconductor manufacturing or a related field, with hands-on packaging or Frontend processes.
• Experience with HBM integration is preferred.
• Bachelor degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics or related field. (PhD / Masters Degree is preferred).
• Development experience in one or more areas of Photo, PVD, CVD, CMP, wafer level molding, wafer level ball mount, TCB, FC, UF, Hybrid bond, Glass carrier bond/ de-bond
• Strong analytical and problem-solving skills, tackle issues and optimize process parameters.
• Effective verbal and written communication and ability to communicate effectively with team members and stakeholders
• Ability to work optimally in a fast-paced environment, with the flexibility to work with global teams across different time zones
• Collaborative attitude with a willingness to work closely with multi-functional teams to achieve common goals.

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$112,500.00 - $238,500.00

Our salary ranges are determined by role, level, and location.  The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations.  Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training.  The pay scale is subject to change depending on business needs.  Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at  [email protected] or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.