Posted:
11/18/2024, 11:19:41 PM
Location(s):
Karnataka, India
Experience Level(s):
Junior ⋅ Mid Level ⋅ Senior
Field(s):
Mechanical Engineering
Workplace Type:
Hybrid
Conceptualizes, documents, and designs tools, flows, and methods (TFM) for use in the physical design implementation of IPs, SoCs, and the interaction/handoff/reuse between IPs and SoCs. Establishes regression flows, drives improvement in RTL to GDS flows, and creates and implements methodologies for improving robustness, power, performance, area, and timing for optimizing physical design constraints. Develops new physical design techniques through innovative scripts, checkers, flows, and other CAD based automation to simplify and expedite the design process. Analyzes retrospective data on current generation quality and efficiency gaps to identify proper incremental, evolutionary, or transformative changes to the existing physical design-related TFM. Partners with physical design, circuits, CAD, RTL, tool/flow owners, and EDA vendor teams to continuously improve physical design methodologies and efficiencies.
Degree(BS/MS) in electronics engineering
Experience : 1.5 to 3.5 years
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.Website: https://www.intel.com/
Headquarter Location: Santa Clara, California, United States
Employee Count: 10001+
Year Founded: 1968
IPO Status: Public
Last Funding Type: Post-IPO Equity
Industries: Artificial Intelligence (AI) ⋅ Information Technology ⋅ Product Design ⋅ Semiconductor ⋅ Software