Leidos Dynetics is seeking a talented Manufacturing Engineer to join a diverse team to create unique solutions for complex problems. With offices across the United States engaging in the defense, space, cyber and commercial fields, Leidos Dynetics provides responsive, cost-effective engineering, scientific and IT solutions.

Primary Responsibilities

Candidate will develop, document, and execute manufacturing processes and procedures for electronic and electromechanical products. Candidate will support production of printed circuit board assemblies (PCBA’s), cable assemblies, and electromechanical assemblies and systems. Applicant will work with a multi-disciplinary team to develop a wide variety of hardware, and work with the latest automated technology used in assembly and test equipment. Candidate will support tasks such as review and approval of engineering drawings, bills of materials, customer quality requirements, and work instructions; participation in design reviews; and execution of manufacturing activities. Candidate will be required to work closely with the design team to complete all details of the design, to prepare the design for release to manufacturing.  Candidate will also work closely with our quality team to develop processes that validate customer quality requirements. 

Basic Qualifications

• Candidate will have a BS degree in engineering (or a science or technical discipline) from an accredited university with at least 2 years of relevant experience or equivalent combination of education and experience.

• Candidate will have at least 2 years of manufacturing engineering experience on programs designing and building electronic hardware to government specifications (or similar).

• Candidate must be a US Citizen and possess (and be able to maintain) a Final Secret Clearance or meet the eligibility requirements to obtain (and maintain) a Secret Clearance.

Preferred Qualifications

• Preferred candidate will have experience with software that maintains bills of materials, and other engineering design data.

• Preferred candidate will have experience in SMT (Surface Mount Technology) processes and equipment. 

• Preferred candidate will have experience with electronics used on launch vehicles, targets, or missile components, and with production of cable harnesses, electronics, and electromechanical assemblies.

• Ability to provide Rough Order of Magnitude (ROM) estimates, Basis of Estimate (BOE) documents, and other documents used to support proposal efforts will be a plus.  Experience with Costpoint Material Planning software and/or Agile product lifecycle management software is a plus. 

• Experience in various quality roles is also a plus.  Experience in using Manufacturing execution systems (MES) is also a plus.

Original Posting Date:

2024-09-19

While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.

Pay Range:

Pay Range $55,250.00 - $99,875.00

The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.