The Allegro team is passionate about providing intelligent solutions that move the world toward a safer and more sustainable future. With more than 30 years of experience developing advanced semiconductor technology, innovation with purpose touches every aspect of our business. From customer engagement and employee recognition to technology advancement and serving the local communities in which we maintain offices, innovation consistently drives our mission and definition of success.
JOB RESPONSIBILITIES:
- Collaboration with cross functional teams including Business Units, Device Design, Manufacturing (internal and sub-contract), Quality and Reliability.
- Creating, maintaining, and updating documentations including standard operation procedures, process flows, workflows, bonding diagrams / drawings, package outline drawings etc.
- Support the release and adoption of the above documentation.
- Documentation / reporting on internal procedures and regulatory body requirements.
MINIMUM QUALIFICATIONS:
- BS or MS in Electrical or Mechanical Engineering or Materials Science with 5+ years of experience in semiconductor product design, development, and operations / manufacturing environment.
- Strong expertise in use of AutoCAD, familiar with GD&T standards.
- Strong expertise in the use of 3D design software such as Autodesk Inventor, SolidWorks, Pro/Engineer (PTC Creo), etc. or equivalent.
- Strong expertise in the use of software such as Microsoft Word, Excel, Power Point, Project, Visio etc. or equivalent.
- Strong oral and written communication skills, self-driven and result oriented.
- Familiarity with project management and APQP processes.
- Familiarity with industry Qualification standards including JEDEC, AEC-Q100, ASME, IPC, IEC, etc.
- Familiarity with package design rules is a plus.
- Familiar with packaging materials including epoxies, molding compounds, wires, solders, leadframe alloys etc. is a plus.
- Knowledge of packaging assembly processes including wafer back-grinding, dicing, wafer bumping, die attach, flip chip, gold and copper wire bonding, transfer, and injection molding, MCM, surface mount, plating, singulation, etc. is a plus.