Our vision is to transform how the world uses information to enrich life for all. 

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 

Our Opportunity Summary: 

For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information.

The role of a High Bandwidth Memory (HBM) System Engineering Intern at Micron Technology, Inc. provides an opportunity to advance the capabilities of generative AI. With the introduction of Micron's HBM3E, the fastest and highest-capacity HBM available, the potential to significantly enhance AI applications is immense. Working with a team of skilled engineers, the Intern will play an important role in optimizing this technology to meet the ever-growing demands of AI innovation and performance. 

As an intern, your mission is to partner with experienced team members in developing innovative solutions for validating our products and enabling their integration in customer platforms.  Your role involves collaborating with a diverse group of experts in Design Engineering, Product Engineering, Process Development, and more to develop new testing and analysis methodologies. 

Disclaimer: While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a teammate motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of premier engineers. In that case, we are determined to help build upon your existing foundation, while rapidly growing your individual and collaborative skills in this exciting and outstanding opportunity. 

What’s Expected Daily: 

• Develop and improve software and hardware to validate HBM in various systems 

• Configure, maintain, and characterize HBM-based systems in a lab environment 

• Assist in debugging complex technical challenges 

• Communicate results to other teammates and leadership 

• Learn more about HBM, DRAM, and memory systems 

How To Qualify: 

• Enrolled in a program to obtain a Bachelor's or Master’s degree in Electrical or Computer Engineering, with graduation date after September 2025 

• Good understanding of computer architecture, memory systems, and memory technologies 

• Excellent Python, C/C++/scripting coding, debugging, and testing skills 

What Sets You Apart: 

• Understanding of system architectures and memory subsystems; Previous experience validating products with both hardware/firmware/software components 

• Experience with Linux 

• Experience with RTL modeling using Verilog or SystemVerilog 

• Experience programming and debugging FPGAs or microcontrollers 

• Familiarity with industry-standard memory interfaces and protocols, such as LPDDR, DDR, HBM, GDDR, CXL, UCIe, and PCIe 

• Hands-on experience with lab equipment including oscilloscopes and logic analyzers 

• Excellent problem-solving and analytical skills 

• A self-motivated, enthusiastic team player who enjoys working with others 

• Good communication skills with the ability to convey complex technical concepts to peers in verbal and written form