Sr/Engineer, PDE TD PI

Posted:
11/14/2024, 4:00:00 PM

Location(s):
Taichung City, Taiwan

Experience Level(s):
Senior

Field(s):
Software Engineering

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR67940 Sr/Engineer, PDE TD PI

JOB DESCRIPTION

As a PDE Central PI, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions. This role requires a strong background in semiconductor packaging, frontend fabrication (FAB) processes, and advanced data analysis skills.

This position involves working closely with cross-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide synergy

  • Improve benchmark performance and efficiency gains through global project management and execution
  • Network BKM leveraging and enhancement, business process creation and re-engineering
  • Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, GQ. Communicate
  • Help drive to fix the issue where necessary

Drive FE-AT Integration initiatives

  • Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
  • Lead & drive FE-AT excursions
  • Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

  • Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

  • Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
  • Process flow simplifications & standardizations
  • Cross technology streamline (Process, tools, etc)
  • Sites expansions process & qualification requirements
  • Drive roadmaps with cross functional teams (FE, AT Procurement, APTD, APPDE)

JOB QUALIFICATIONS

  • Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
  • 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI).
  • Strong background in frontend fabrication processes (FAB) is highly desirable.
  • Proven experience in data analysis, statistical process control (SPC), and process optimization.
  • Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
  • Excellent communication and teamwork skills, with the ability to work across departments and with external partners.

PREFERRED SKILLS

  • Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
  • Experience leading cross-functional teams in process development, technology transfer, and ramp-up.
  • In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at [email protected].

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Micron Technology

Website: https://micron.com/

Headquarter Location: Boise, Idaho, United States

Employee Count: 10001+

Year Founded: 1978

IPO Status: Public

Last Funding Type: Post-IPO Equity

Industries: Computer ⋅ Hardware ⋅ Manufacturing ⋅ Semiconductor