Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. 

HBM Design Technology Package Co-Optimization integrates across various teams to define, design and material specifications. Defining needed test vehicles and test requirements to enable advanced package development and further product qualifications. Segmenting and resolving chip/package interaction issues.

Micron HBM Design Technology Package Co-Optimization team is looking to hire an experienced semiconductor packaging Principal Engineer. Our Team’s Vision is to enable predictable delivery of industry leading HBM through defining requirements for design, technology and package to mitigate chip-package interactions.

(Disclaimer): While you may not exhibit all the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of premier engineers. In that case, we are determined to help build upon your existing foundation, while rapidly growing your individual and collaborative skills in this exciting and outstanding opportunity. 

*This position will be a hybrid role located in Richardson, TX

*The seniority level offered will be based on a combination of experience and education. 

The responsibilities include

• Integrating across various adjacent teams to define design and material specifications
• Defining needed test vehicles and test requirements to enable advanced package development and further product qualification
• Segmenting and resolving chip/package interaction issues

The requirements include

• Masters in with >10 yrs experience or PhD with >5yrs
• Strong technical knowledge of thermo-mechanical issues associated with advanced packaging and heterogenous integration
• Demonstrated ability to lead cross functional teams like physical layout, package-level simulations and other related disciplines
• Strong interpersonal and communication skills to be successful in a team-oriented collaborative work environment

What Sets You Apart: 

• Excellent problem-solving and analytical skills 

• A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds 

• Good communication skills with the ability to convey complex technical concepts to other design peers in verbal and written form 

• Having an innovative approach that is open to improving upon any of our processes or products. 

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$152,500.00 - $372,500.00

Our salary ranges are determined by role, level, and location.  The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations.  Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training.  The pay scale is subject to change depending on business needs.  Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at  [email protected] or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.