DRAM Technical Packaging Manager

Posted:
7/9/2024, 11:49:03 AM

Location(s):
Idaho, United States ⋅ Boise, Idaho, United States

Experience Level(s):
Expert or higher ⋅ Senior

Field(s):
Product

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Compute DRAM Technical Packaging Manager for the Package Development Engineering organization at Micron Technology, Inc., you will be responsible for ensuring the execution of all of Micron’s New Product Development processes from concept and feasibility stages, through planning, design, validation, qualification and ultimately through safe-launch and product ramp for pioneering Compute DRAM Package products. These duties include leading and driving critical decisions for packaging architecture, materials selection, reliability, design rules, budget and road maps. You will be responsible for working with Business Unit General Managers and Directors, Manufacturing Leaders, and Packaging Partners to attain best in class package performance, cost, quality and timelines.

Job Description

General responsibilities of the position are the following:

Responsibilities and Tasks:

  • Lead package development team to attain success product launch of Compute DRAM packages.
  • Provide technical leadership in package architecture, materials selection, design rules, and reliability.
  • Develop package enabler roadmaps and communicate strategy for global packaging organizations and assembly sites.
  • Lead multi-functional initiatives that deliver next generation capabilities and position Micron's DRAMs as the industry leader.
  • Work with Leadership and other functional areas to develop business processes that will enhance package development operational efficiencies.
  • Apply business insight within corporate product teams to achieve packaging and Assembly strategic outcomes.
  • Provide technical leadership in customer interfaces to drive next generation requirements and package technology.

Requirements and Skills:

  • Able to serve as inspiring leader in packaging.
  • Lead the development of programs that are critical to Micron packaging and ensures execution of the function.
  • Ensures programs are aligned with customers’ current and future needs and expectations.
  • Participates in setting package strategy for Micron.
  • Make decisions that significantly impact the future success of Micron’s package solutions and its ability to challenge in the marketplace.
  • Have a broad global reach.
  • Apply deep knowledge of packaging to guide strategy and develop roadmaps, solve complex problems, and develop other team members.
  • Must be able to work independently with minimal direction.

Education and Experience:

  • Bachelors/Masters/PhD in Engineering field
  • 10+ years industry experience
  • Program management and soft skills
  • The ideal candidate will have engineering experience with High Bandwidth Memory (HBM) manufacturing, TSV, CoW, CSP, fan-out, fan-in and other advanced packaging technologies.

Qualifications:

  • Fluent in English written and verbal communication
  • Demonstrate clear communication of technical issues to Company Executives
  • Deep knowledge of Assembly Process, Equipment, Materials and Integration

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at  [email protected] or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Micron Technology

Website: https://micron.com/

Headquarter Location: Boise, Idaho, United States

Employee Count: 10001+

Year Founded: 1978

IPO Status: Public

Last Funding Type: Post-IPO Equity

Industries: Computer ⋅ Hardware ⋅ Manufacturing ⋅ Semiconductor