Posted:
2/25/2026, 3:01:17 AM
Location(s):
Pittsburgh, Pennsylvania, United States ⋅ Pennsylvania, United States
Experience Level(s):
Internship
Field(s):
Mechanical Engineering ⋅ Software Engineering
Workplace Type:
On-site
Company Name: Hellbender Inc.
Job Title: Robotics Software Engineering Internship
Department: Software
Report to: Software Engineering Manager
Who we are:
Hellbender Inc. is a Pennsylvania Benefit Corporation who partners with innovators to mature their Artificial Intelligence enabled computing sensors and produce their solutions onshore at prototype to high volumes.
Hellbender is intentionally forming an inclusive work environment and is committed to uplifting the historically marginalized identities including veterans, women, trans and non-white races in our community and industry.
Job Summary:
At Hellbender, you will have the opportunity and responsibility to generate innovative solutions
to address unique issues on a variety of real world problems. As an intern, you will have the
same autonomy as our junior engineers and the mentorship of our senior staff. Our program is
designed to teach you the full product development life cycle and the work will take you back
and forth from the white board to the automated manufacturing line. The coding will consist of
Real-Time/Object Oriented C, C++, and Python development in an embedded Linux
environment.
Eligibility Requirements
An ideal candidate would have prior internship experience at a manufacturing or engineering
based organization. We accept college masters and PhD level students.
Please note that this is a full time, on-site position.
Essential Duties and Responsibilities:
Work Location: UPARC Pittsburgh
Opportunity for advancement:
Hellbender is a growing business and follows a policy that prioritizes internal promotions. As new positions are created new opportunities for advancement will be created as well.
Website: https://www.hellbender.com/
Headquarter Location: Pittsburgh, Pennsylvania, United States
Employee Count: 11-50
Year Founded: 2021
IPO Status: Private
Last Funding Type: Grant
Industries: Electronics ⋅ Manufacturing