Job Description:

As an Astera Labs Senior Package Design Engineer, you will be part of the packaging team that designs-in and supports Astera Labs’ portfolio of connectivity products in the world’s leading cloud service providers and server and networking OEMs. In this role, you are responsible to design the packages substrate independently from definition to package tape-out, by working on provided netlist and specification, through performance optimization, design for manufacturing, sign-off verification, etc. You will work in a cross-functional environment with SI/PI team, package program management, product engineering/test, hardware engineering, etc.    

Basic qualifications:

• BS/MS in Engineering Degree required (e.g., Electrical, Mechanical, Materials Science, Physics, etc.).
• Minimum of 5 years of experience with Cadence APD/SIP. Able to design and layout a FCBGA/FCCSP package from start to tape-out independently.
• Experience in large FCBGA/FCCSP package design in high speed SoC is highly desired.
• Familiar with BGA package substrate technologies and assembly process. Good understanding of BOM, stackups, high speed design rules and guidelines. Working knowledge of package reliability, SI/PI, etc.
• Entrepreneurial, open-mind behavior and hands-on work ethic with the ability to prioritize a dynamic list of multiple tasks.
• Excellent teamwork and collaboration, thriving in a dynamic environment, and possessing strong communication skills to effectively work with cross-functional teams and adapt to ever-changing situations.

Required experience:

• Proficiency in Cadence APD/SiP is a must. Able to design large body BGAs from concept to tape out.
• Good understanding of BGA package BOM and integration into APD layout and routing design rules.
• Setup layer-stackup, padstacks, design constraints (physical and electrical), SMT components, optimize design based on SI/PI simulation result and design reviews. Understanding of transmission line theory and SI/PI fundamentals is a plus.
• Conduct DRC/DRV/LVS/DFM checks with given tools, perform design review reporting, and Gerber and artwork releasing. Generate all required package design documentations.
• Perform feasibility studies such as fan-out, mockup design, layer & package size reduction, etc.
• Basic knowledge of packages manufacturing flow, supply chain, reliability, risk management and failure analysis.
• Drive new design flow development in APD with given new package types or technologies. Drive methodology and productivity improvements in package design by working with vendors or scripting.

 Preferred experience:

• Multi-chip, interposer, 2.5D or heterogeneous package design experience is a plus.
• Proficiency in scripting languages for design and reporting automation is a plus.

The base salary range is $130,000.00 USD – $185,000.00 USD. Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.