Sr. Firmware Engineer

Posted:
1/14/2026, 1:22:52 AM

Location(s):
Allentown, Pennsylvania, United States ⋅ Pennsylvania, United States ⋅ Fort Collins, Colorado, United States ⋅ San Jose, California, United States ⋅ California, United States ⋅ Colorado, United States ⋅ Nebraska, United States

Experience Level(s):
Senior

Field(s):
Software Engineering

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Job Description:

Basic details 

Job Title: Senior Firmware Engineer 

Location: Allentown, PA, Fort Collins, CO, or San Jose, CA 

Job Description: A Firmware engineering position responsible for developing embedded software for Broadcom products targeted at hyperscale data center applications. Broadcom’s market-leading products are enabling the next generation of AI and cloud storage.

Essential Duties and Responsibilities: 

Design and implementation of firmware for new integrated circuit products using C and C++ 

● Develop quality software using best practices for all phases of the software design life cycle – analyze requirements, design solutions, code, test, and support. 

● Firmware integration and bring-up of new hardware and emulated hardware 

● Debug embedded software using typical lab equipment like in-circuit emulators and logic analyzers 

● Analysis of new customer feature requests and opportunities to continuously improve the product 

● Collaboration across multiple teams to root cause and resolve issues 

The Successful Candidate Will: 

● Possess a deep passion for coding and the science behind computer and software engineering, demonstrating a commitment to continuous learning and staying current with modern industry practices. 

Be proficient with version control (e.g., Git/GitHub) and open-source tools like Python. You automate builds, are highly skilled with C/C++ toolchains, and are comfortable navigating an operating system and writing shell scripts. 

● Have a passion for continuous improvement and a commitment to creating quality output. 

● Exhibit strong teamwork skills and thrive in a fast moving, multi-site team environment. 

● Have a strong understanding of hardware/software interfaces and understand common embedded software design constraints, such as memory usage, power consumption, and speed optimization. 

Minimum Qualifications:

● Bachelor’s Degree in Electrical Engineering, Computer Engineering, Computer Science, or similar 

● 8+ years of experience developing software, ideally on an embedded target 

● In depth experience in C and C++ with Python a plus 

Preferred Qualifications:

● Experience with hyperscaler systems and architectures 

● Familiarity with developing on emulated hardware or simulated hardware

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $108,000 - $172,800. 

 

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Broadcom Limited

Website: https://broadcom.com/

Headquarter Location: San Jose, California, United States

Employee Count: 5001-10000

Year Founded: 2005

IPO Status: Public

Last Funding Type: Post-IPO Debt

Industries: Electronics ⋅ Information Technology ⋅ Manufacturing ⋅ Semiconductor