Packaging Engineer

Posted:
7/23/2024, 9:22:59 PM

Location(s):
Center District, Israel ⋅ Rishon LeZion, Center District, Israel

Experience Level(s):
Mid Level ⋅ Senior

Field(s):
Mechanical Engineering

Packaging Engineer

We are looking for a highly talented mechanical engineer/packaging engineer to join our MFG (Manufacturing) jigs team that supports manufacturing jigs design , Technical changes, continuous product improvement requirements and more.

What’s in it for you?

Working in an amazing company, within an exciting, supporting, and challenging group.

Our Group: MFG Jigs and PCR’s

The MFG jigs team is part of the PDC Engineering team, working in tight collaboration with the R&D department and all operation teams including manufacturing, materials, Industrial engineers, supplier engineers and others.

The team is managing the PCR’s from manufacturing, jigs design and various of engineering tasks to support the organization's growth.

Job Description

  • Develops and designs packaging equipment and materials for safe, cost effective and convenient transport of goods under a variety of conditions.
  • Analyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience, utility and function based on the product's physical characteristics, safety and special-handling requirements.
  • Evaluates packaging and transporting methods and procedures to ensure compliance with safety and quality standards. Evaluates and recommends efficient packing procedures, innovations in packaging materials, and utilization of sealing and fastening devices.
  • Develops new packaging or containers to meet established requirements and maintains oversight and quality of existing packages/containers for all product groups. Defines package requirements for product groups and customer requirements.
  • Develops recommendations according to the nature of the product, cost limitations, legal requirements, and the type of protection required, taking into consideration the need for resistance to external variables.
  • May be responsible for coordination of activities and logistics at secondary contract packaging and labeling sites. Responsibilities may include documentation management and an understanding of good manufacturing practices (GMPs). Uses appropriate tools and performs integrity analysis of packaging.

What should you have?

  • B.Sc. in Mechanical Engineering
  • 3-5 years experiences in mechanical design.
  • Packaging design experience -Advantage,
  • CAD experience with SolidWorks and Inventor, knowledge with TeamCenter and other operational systems – Must
  • Skills to lead and manage technical projects.
  • High motivation and passion, Team player, good collaboration with others, self-learning and ability to work alone.

Who we are?

Applied Materials Israel is home to the Process Diagnostics and Control business unit (PDC). Based in Rehovot, we develop, manufacture and market cutting-edge machine learning and computer vision-based metrology and inspection products that are essential elements in wafer fabrication. By playing a significant role in enabling the production of the next generation of microchips, our expertise enables our customers to transform possibilities into reality.

Qualifications

Education:

Bachelor's Degree

Skills:

Certifications:

Languages:

Years of Experience:

4 - 7 Years

Work Experience:

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Not Specified

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. 

Applied Materials

Website: https://appliedmaterials.com/

Headquarter Location: Santa Clara, California, United States

Employee Count: 10001+

Year Founded: 1967

IPO Status: Public

Last Funding Type: Post-IPO Equity

Industries: Electronics ⋅ Manufacturing ⋅ Semiconductor ⋅ Software