- Member of cross-site Assembly Engineering and automation Team

- Reporting to Director Automation

• Design, technical spec generator, implement advanced automation systems, including robotic handling, and edge grippers, tailored to semiconductor manufacturing.
• Optimize workflows and production processes to increase throughput and reduce bottlenecks through automation.
• Develop integration strategies for automation systems with existing semiconductor equipment, ensuring seamless operations.
• Establish predictive maintenance schedules for automated equipment to minimize downtime and improve reliability.
• Lead research and development of emerging technologies, including AI, IoT, and machine learning, for enhanced automation in semiconductor manufacturing.
• Conduct system performance analysis and propose enhancements to achieve precision, efficiency, and consistency in operations.
• Ensure compliance with SEMI standards, safety protocols, and industry regulations.
• Collaborate with cross-functional teams to execute automation projects, including planning, budgeting, and technical validation.
• Required to drive UG for Assembly equipment
• Support Quality activities

Requirements

• Bachelor’s or Master’s degree in Mechanical, Electrical, or Robotics Engineering.
• Minimum of 10 years of experience in automation within semiconductor manufacturing environments.
• Strong understanding of automated material handling systems (AMHS) techniques.
• Proven track record of implementing automation solutions to improve manufacturing efficiency.
• Knowledge of SEMI standards and compliance requirements.
• Excellent analytical and problem-solving skills for addressing complex automation challenges.

More information about NXP in Malaysia...

#LI-633a