Research Associate (High Temperature-Resistant & Miniaturized Payload Hardware Design)

Posted:
4/9/2025, 4:47:15 PM

Location(s):
Singapore, Singapore

Experience Level(s):
Junior ⋅ Mid Level

Field(s):
Mechanical Engineering

Centre for Advanced Robotics Technology Innovation (CARTIN) are looking for a hardware-focused Research Associate to design and prototype a compact and heat-resistant multi-sensor payload. The system must withstand temperatures of 250°C for 10 minutes (without external cooling) while maintaining internal stability for embedded electronics.

Key Responsibilities:

  • Design compact mechanical housing to operate under 250°C ambient conditions.

  • Ensure internal core temperature remains under 55°C during runtime.

  • Select and integrate miniaturized components (compute, battery, sensors).

  • Strip sensor casings and reassemble into a custom mount with thermal shielding.

  • Perform heat simulation, thermal insulation, and shock-resistance design.

  • Test hardware in specified sites and environments.

Job Requirements:

  • Bachelor or Master in Mechanical Engineering, Mechatronics, or similar.

  • Strong experience in heat-resistant enclosure design and miniaturized hardware integration.

  • Familiar with thermal simulation tools (ANSYS, SolidWorks, etc.).

  • Experience with IP65/ IP67 standards, fanless computing, and embedded design.

  • Knowledge of fire-fighting robot or harsh-environment robotic platforms is a plus.

Join our team to build a compact and thermally protected SLAM sensor payload for extreme environments. The candidate will design hardware that survives 250°C conditions while maintaining internal electronics <55°C. Experience with high-temp materials, mechanical CAD, and embedded platform integration is essential. Ideal for Mechatronics/Mechanical engineers with strong prototyping skills.

We regret to inform that only shortlisted candidates will be notified.

Hiring Institution: NTU