Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR48371 Sr. Engineer, NEW TECH DEV

As a senior engineer in Micron’s Advanced Packaging Technology Development (APTD) group at Taiwan Taichung, you will be responsible for assembly process development and pathfinding project related activities for memory devices application.

In this position, you will work with Micron engineers, technology partners and vendors to develop unit processes that meet device requirements for next-generation semiconductors, integrate processes as part of cross-functional teams.

Additionally, you will address process issues with pilot line manufacturing and work on continuous improvements for manufacturability.

RESPONSIBILITIES:

• Develop and lead assembly processes from the conceptual phase to high-volume production for highly complex package development challenges.
• Work closely with multiple cross functional teams including wafer bump process development team, process integration, packaging, and program integration team.
• Define the milestones and deliver the risk assessment, mitigation plan, with various resources.
• Select equipment and material to meet quality, reliability, cost, yield, and production targets.
• Interface with equipment and material suppliers inducing tool setup, BKM recipe develop, buyoff and continuous improvement activities.
• Able to work independently along with various projects inside of APTD team.

Basic Qualifications:

• Bachelor’s degree in physics, chemistry, electrical engineering, mechanical engineering, material science, or other applied engineering discipline.
• Minimum of 5 years of hands-on working experience on semiconductor packaging process including assembly, bumping and / or RDL process.
• Understanding on technical risk assessment, setup mitigation plan, FMEA, and SPC.
• Verbal and written communication skills in English

Preferred Qualifications:

• Experience in semiconductor packaging industry more than 7 years.
• Strong focus on advanced package technology (2.5D or 3D package, heterogeneous integration, or fan-out wafer level) research and development.
• Depth in packaging technologies such as BGA, fcCSP, WLCSP, SIP, TSV, and SOC.
• Hands on experience on flip chip die attach, thermo-compressive bonding, wafer clean, plasma activation.
• Understanding on statistical process control and development with structured DOE.
• Understanding on various PFA analysis and method
• Highly skilled at problem-solving activity and capability of leading cross functional team.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at [email protected].

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.