Job Summary: Introduction 

Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community. 

As a Member Technical Staff “SMTS” in the Advanced Packaging Technology Development team at Micron Technology, Inc, you will be part of a team that is responsible for providing technical leadership that influences and sets Advanced Packaging strategic direction. This is achieved through collaboration with internal and external stakeholders to build and execute innovative advanced packaging technology integration strategies. In this role You will have the opportunity to engage and influence the direction of innovative solutions to meet Best in Class technology solutions that align with corporate strategic objectives and contribute to the company’s success, measured through increased revenue, cost savings, customer, and design wins. 

Responsibilities include, but are not limited to: 

• Continuously deliver high value, differentiated technology solutions by recognizing opportunities and driving technical innovation that deliver business value aligned with corporate strategic objectives. 

• Ongoing collaboration with internal and external customers and suppliers 

• Interact with senior management to provide consultation and influence technical and strategic decisions. 

• Lead cross-functional technical teams, discussions, tiger teams, and task force activity both inside and outside the functional area and department. 

• Initiate and sustain effective communication with internal and external stakeholders. 

• Understand competitive trends/threats/requirements and opportunities and provide perspective that can directly influence technical solutions to improve Microns current and future competitive position. 

• Actively participate in technology events (conferences, workshops, forums) 

• Providing guidance and direction in setting packaging technology roadmaps 

• Actively assess competitive position through data intelligence 

• Contribute to the outcome of requirement negotiations by providing solid and clear technical data/content. 

• Leverage technical experience to develop innovative technology and exhibit mastery of technical knowledge both within and external to the primary contribution area. Reach to span across different technical disciplines, geographic areas, organizational boundaries, and the industry. 

• Directly inspire the technical growth of others, demonstrated in many ways such as organized teaching, individual influence, and presentations. 

• Actively build a technical network that spans across areas. 

• Assist in the troubleshooting of escalated issues and provide coaching for resolution. 

• Demonstrate a continuous focus on innovation through generation of patents, trade secrets, technical presentations, technical papers, which result in design wins, cost reduction, and quality improvements. 

• Manage, engage in, and promote continuous cost reduction and quality improvement efforts. 

Qualifications and Skills include, but not limited to: 

• >10 years of professional experience in semiconductor advanced packaging with specific experience in BEOL, MEOL and Assembly Advanced Packaging process integration for memory device as it applies to stacked TSV enabled 3D advanced packaging technology. 

• Degree/Major: BS, MS or Ph.D. in Electrical, Chemical, Mechanical Engineering, Physics and/or related field 

• Deep knowledge of High Bandwidth Memory, 2.5D integration and emerging 3D integration strategies including Hybrid bonding. (Required) 

• Direct process module engineering experience: Wafer Level Packaging (Bumping and & Re-distribution Layer) or 3D stacking process (Required) 

• Experience working in/with DRAM manufacturing company and OSAT companies (Preferred) 

• Understanding of DRAM wafer structure and process flows (Highly Preferred) 

• Experience industry (Customer / Competitor / OSAT player) benchmarking and competitive analysis (Required) 

• Time & Project Management skills 

• Fluent communication skill in English (Required) with Korean and Chinese (Preferred) 

• Passion for Innovation as evidenced by patent invention or published literature (Preferred)