Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

JR66457 Director, Heterogeneous Integration Group(HIG), High Bandwidth Memory(HBM) - Media Health, High Volume Manufacturing (HVM)

As the Director of HIG HBM Media Health HVM, you will lead and develop a high-performing team to driving Media Health Manufacturing and HBM Reliability activities within the HBM Systems and Product Engineering Team. You will lead a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale.  You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization.

Leadership Responsibilities

• Leadership Development: By coaching and providing career development, this role ensures the growth of future leaders in the semiconductor industry, which is vital for driving innovation and technological advancement.

• Skill Enhancement: The role involves identifying strengths and creating specific development plans to improve skills. This continuous skill enhancement is crucial to keep up with the rapidly evolving technology landscape.

• Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.

• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.

• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

• Product Alignment: Managing technical projects to align product performance and manufacturing flows across HBM products ensures consistency and high quality in the production process, which is key to the successful implementation of current and upcoming technology.

• Active Participation in Technology Events: The role requires active participation in technology events (conferences, workshops, forums etc.) within Micron. This participation is crucial for staying updated with the latest trends and developments in the industry.

• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Technical Responsibilities

• Optimized Test Coverage: The responsibility of ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes is a technical aspect of this role. This is crucial for maintaining the effectiveness and efficiency in high-volume manufacturing.

• Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.

• Product Development and Validation: This role is pivotal in developing, validating, characterizing, and qualifying Micron’s next-generation HBM products. Ensuring that these products are reliable and meet the necessary standards is a technical task that directly impacts the market readiness of the products.

• Support for New Product Design Verification: The role provides support for design verification and in-depth circuit of new products using CAD tools and Verilog simulations. This technical support is crucial for the development of new products and technologies.

• Yield Improvement and Cost Reduction: The role involves technical tasks like improving manufacturing test yields (Specifically related to Device Issues from the DRAM, Interface and Stacked Die Yield), reducing test time, and resolving yield-related issues. These activities are critical for cost reduction and meeting yield targets.

• Root Cause and Resolution of Qual and RMA Device Issues

• Time 0 and Field DPM Reduction: Leads the team who drives the DPM reduction for HBM  qualification by documenting DPM FMEA, Developing and validating Stress/Screen, New DPM  feature validation and deployment, Performing electrical failure analysis , understanding root cause and providing solution space. In order to achieve this role requires executing wafer level, Cube on Wafer and iQP activities, synchronize with manufacturing for tester resources, plans capacity and lab equipment.

• DPM Task Force Leadership: Leading task forces on DPM projects related to the Fab process requires ownership within PE and coordination with multiple teams. This role is essential for addressing and resolving critical issues coming from component and system platform  that may arise during the qualification process.

• Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of NAND products, which are key components in many modern technologies.

• Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.

Requirements

• Bachelors/Masters Electrical Engineering Degree with 10+ years of experience in the semiconductor industry. Micron and Product Engineering Experience is preferred.

• Demonstrating Strong Leadership Skills and Technical Skills 10+ years of experience in the semiconductor industry.

• Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).

• Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.

• Strong sense of responsibility and accountability towards assigned role with professional work ethic.

• Work on site in Singapore with international travel to Taiwan and USA

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.