Posted:
2/24/2026, 11:27:39 AM
Location(s):
Taipei, Taiwan
Experience Level(s):
Internship
Field(s):
Software Engineering
Workplace Type:
Hybrid
This is a one-year internship.
As a Customer Engineer - Thermal intern: -
You will be working with experienced Intel engineers on exploring the opportunities to further optimize thermal mechanical solutions for next generations AI server platforms, and pathfinding new methodologies to address the thermal challenges for future AI systems and racks.
You'll also have opportunities to participate industry conferences and support ecosystem enablement activities to connect with MNCs, ODMs, and key component/solution suppliers.
Master's in mechanical engineering, Mechatronics Engineering or related field preferred.
Familiar with Thermal/Mechanical simulation/computing analysis and related development tools such as Pro-E, ABAQUS, Flotherm, IcePak, 6-Sigma, etc.
Good programming skills in python and familiar with software development process and development tools like git is a plus.
1 year internship program. Full time- 40 working hours weekly in July and Aug 2026, and Part time- 24 hours per week for the remainder of 10 months (in Sep 2026 - June 2027).
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Website: https://www.intel.com/
Headquarter Location: Santa Clara, California, United States
Employee Count: 10001+
Year Founded: 1968
IPO Status: Public
Last Funding Type: Post-IPO Equity
Industries: Artificial Intelligence (AI) ⋅ Information Technology ⋅ Product Design ⋅ Semiconductor ⋅ Software