Front-End (Wafer Process) Tool Maintenance Technician

Posted:
7/30/2024, 5:00:00 PM

Location(s):
Kanagawa Prefecture, Japan ⋅ Sagamihara, Kanagawa Prefecture, Japan

Experience Level(s):
Junior ⋅ Mid Level ⋅ Senior

Field(s):
Mechanical Engineering

It's fun to work in a company where people truly BELIEVE in what they're doing!
We're committed to bringing passion and customer focus to the business.

If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!

Responsibilities:

  • Responsible for improving existing FE stable operation and introducing new preventative maintenance (PM) plan and activities to realize mass-production capacity ramp as tool maintenance engineer.
  • Execution of regular tool maintenance and management of manufacturing tool stabilization (Correspondence to sudden malfunction of manufacturing tools) by day and night shift work.
  • Planning and execution of PM activities for manufacturing tools.
  • Wafer process condition check for fixed manufacturing after the resumption.

Expected Background:

  • High school graduate or above.

Expected Skill:

  • Highly recommend if applicant have experience in charge of semiconductor wafer process tools or manufacturing line process development of semiconductor optical devices.
  • Work experience in manufacturing fab.

We are an equal opportunity employer and value diversity at our company.

We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status.

We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment.

Please contact us to request accommodation.

Lumentum Operations LLC

Website: https://lumentum.com/

Headquarter Location: Milpitas, California, United States

Employee Count: 5001-10000

Year Founded: 2015

IPO Status: Public

Last Funding Type: Post-IPO Debt

Industries: Telecommunications