Posted:
11/25/2024, 6:38:44 AM
Location(s):
Maryland, United States
Experience Level(s):
Expert or higher ⋅ Mid Level ⋅ Senior
Field(s):
Mechanical Engineering
The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative Test Engineer Circuit Design or Principal Test Engineer Circuit Design located at our Linthicum, MD facility. Advanced Technology Lab (ATL) is located just outside of Baltimore, MD - where we design, manufacture, and test semiconductor products for internal and commercial production as well as emerging programs. We have over 21,000 square feet of Class 100 wafer fabrication cleanroom that supports variants of Si; SiGe; GaAs; SiC.
Northrop Grumman’s ATL semiconductor foundry is a unique capability supporting a range of production microelectronic devices (Silicon, Silicon Germanium, Gallium Arsenide, Gallium Nitride, Silicon Carbide, Carbon Nanotubes) and providing leading edge technology development in superconducting electronics. Our devices enable a number of Northrop Grumman’s ground-based radars, avionic radars, and space systems. Join us for the chance to work with an amazing, experienced, and talented team while helping serve your country. Enjoy the opportunity to grow and learn with a variety of challenging projects in R&D, ongoing long-term programs, and new programs targeting future military platforms. Our multidisciplinary foundry team enables activities from development to sustainment process engineering. ATL is responsible for all aspects of semiconductor technology including design, mask making, wafer fabrication, test, and assembly. The candidate must be a strong team participant, have excellent communication skills, and be resourceful and multitalented. A strong understanding of semiconductor technology and microelectronic manufacturing test methodologies is essential.
The Test Engineer Circuit Design or Principal Test Engineer Circuit Design will support development and execution of Process Control Monitoring device test for various fab technologies. The individual will be responsible for understanding test requirements, documenting test plans, and developing necessary software and hardware solutions. Administrative and technical responsibilities include test software and hardware development, daily and forward-looking test scheduling, test data integrity, equipment/software improvements, and supporting the procurement of test equipment. Additional responsibilities include, but are not limited to, ensuring configuration control of test software and hardware, test quality, test documentation quality, test equipment calibration, and compliance to customer documents (e.g., Source Control Documents). The candidate must exhibit excellent verbal and written communication skills.
This requisition may be filled as a Test Engineer Circuit Design or Principal Test Engineer Circuit Design.
Basic Qualifications for Test Engineer Circuit Design
Bachelor’s degree in Electrical Engineering with 2+ years related experience; Master's Degree in Electrical Engineering with 0+ years' experience
Direct semiconductor test engineering experience.
Direct experience in leading with a team of test and product engineers.
Software skills in a modern language such as C#, Python, C++ or Java.
U.S. Citizenship required
The ability to obtain and maintain a DoD Secret clearance is required.
Basic Qualifications for Principal Test Engineer Circuit Design:
Bachelor’s degree in Electrical Engineering with 5+ years related experience; Master's Degree in Electrical Engineering with 3+ years' experience; or PhD in Electrical Engineering with 0+ years of experience
Direct semiconductor test engineering experience.
Direct experience in leading with a team of test and product engineers.
Software skills in a modern language such as C#, Python, C++ or Java.
U.S. Citizenship required
The ability to obtain and maintain a DoD Secret clearance is required.
Preferred Qualifications:
Degree GPA of 3.3/4.0 or higher.
Experience making discreet device measurements.
Knowledge of Process Control Monitoring (PCM) devices.
Experience with wafer or die testing, including ATE Tester and prober operation.
Direct hands-on experience building / repairing test hardware.
Experience with statistical process control methodologies and software.
Exhibit leadership & teamwork capabilities, interpersonal communication skills, both inside and outside of work environment(professional/community/extracurricular).
Direct experience in preparing and presenting presentations to cross-functional teams.
Website: https://northropgrumman.com/
Headquarter Location: Falls Church, Virginia, United States
Employee Count: 10001+
Year Founded: 1994
IPO Status: Public
Last Funding Type: Grant
Industries: Data Integration ⋅ Manufacturing ⋅ Remote Sensing ⋅ Security ⋅ Software