Our Team :

Team works on a new product development machine for Lithography and Inspection tools for Advanced packaging. Presently tool we have introduced product at major semiconductor companies and working on next generation platform. Team in India works on core modules and owners for many modules. Team comprises of mechanical, electrical, electronics and software functions and also, we have a proto-lab for concept and feasibility approach.

Work with global team in Santa Clara, Taiwan, Japan and world-wide field customers.

Team was formed last 5+ years, and Total India team size is 25. Team has many accolades and won many teams of the quarter awards.  

Motto of team is: ‘Alone we can do so little; together we can do so much.’

Your Opportunity:

As FEA expert Lead see it’s a unique and critical role for our Product development, with Roles and Responsibility listed below, and growth would see in T shaped approach with both breadth (Capacity) and Depth (Capability).

Essential Responsibilities:

• Highly proactive with strong analytical, problem-solving skills, and advanced-level knowledge of machine design.

• Perform variety of engineering analyses using first order calculations and FEA tools, in areas of static structural deformations, dynamic structural analysis, thermal and flow. Optimizes designs based on analysis, often in collaboration with design engineers.

• Perform thermal design and analysis of Mechanical, Optics and electronics assemblies components to estimate thermal performance, including thermal distribution, hotspots, and critical components.

• Experience in the simulation driven structural design of large mechanical assemblies.

• Proficient in analytical calculations of bolted/welded joints, static linear, nonlinear, dynamic, buckling, and fatigue analysis. Good understanding of HCF/LCF and fracture mechanics.

• Knowledge of material selection.

• Demonstrate strong system-level thinking and the ability to provide design suggestions based on simulation results.

• Produce high-quality documentation for assigned work.

• Ability to analyze problems from a physical perspective and provide quick, system-level solutions.

•  Experience interacting with multiple teams to ensure design meets all requirements.

•  Ability to work independently with minimal supervision in a fast-paced, rapidly changing work environment.

Required Qualifications And Skills

• M.Tech in Mech/Aero/Applied Mechanics from a reputed institution such as IIT/IISc/NIT

• Experience Level 8 - 14 years of experience in Heat Transfer ,CFD and thermal management of Mechanical, Optics and electronics assemblies

• Strong understanding of heat and mass transfer fundamentals and CFD.

• Extensive experience with Ansys Fluent and workbench for detailed system-level analysis (fluid dynamics and heat transfer fundamentals).

• Hands-on experience with 3D design software Autodesk Inventor (preferable for transferring 3D models to the Ansys environment).

• Knowledge of Commercial tools such as Icepak, Flotherm, Fluent, Ansys Workbench, ICEM CFD, Hypermesh

• Strong understanding of physics related to thermal performance of components in Semiconductor Equipment’s

• Experience in Electronics Cooling , die and PCB level modeling is a plus

• Experience in Thermal-Electric simulationg using ANSYS Maxwell is a plus

• Good communication skills both oral/writing

Qualifications

Education:

Bachelor's Degree: Mechanical Engineering

Skills:

Certifications:

Languages:

Years of Experience:

7 - 10 Years

Work Experience:

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

Yes

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.