Job Title: Intern, Signal & Power Integrity (Summer 2026)
Office Location: San Jose, CA
Work Model: Onsite
Duration: June 2026 - August 2026
At SK hynix America, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape.
We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.
About the Role:
-
We are offering an exciting opportunity at SK Hynix America for an IC Packaging electromagnetic (EM) simulations and SIPI (Signal Integrity/Power Integrity) Analysis Intern to join our dynamic engineering team. In this position, you will work on advanced semiconductor packaging projects, gaining hands-on experience in 3D modeling and high-speed digital system analysis of advanced packages. You will be introduced to the basics of the advanced package design and manufacturing process flow. This is a very exciting opportunity for a candidate aspiring to build up professional growth and be part of SK Hynix success.
- Projects will be assigned to the intern(s): High-Speed Signal Integrity Analysis for 2.5D IC Packages.
Responsibilities:
- Become familiar with various IC packaging structures and the process steps involved in making the end product.
- Learn the basics of using numerical analysis tools such as ANSYS AEDT(HFSS, Q3D) etc.
- Learn the basics of using numerical analysis tools such as ADS, HSPICE etc.
- Start developing package-level electrical Finite Element Analysis (FEA) Models to characterize S-parameters and RLC in the packages.
- Conduct signal and power integrity simulations across the entire product lifecycle, from feasibility and pre-layout to post-layout and validation.
- Learn to design and layout guidelines for IC packages and PCBs to ensure signal and power integrity.
- Document all simulation models, codes, and scripts and present the results in simple and clear terms to a broader audience.
Qualifications And Education Requirements:
- Currently pursuing a Master's or PhD's degree in Electrical Engineering or a related field.
- Strong interest in transmission line theory, electromagnetic concepts and its applications in semiconductor packaging.
- Strong interest in signal integrity, power integrity fundamentals and its applications in semiconductor packaging.
- Strong problem-solving and analytical skills.
- Excellent communication and teamwork abilities, with a desire to collaborate effectively in a multidisciplinary environment.
Preferred Skills
- Currently pursuing a PhD's degree in Electrical Engineering or a related field
- Familiarity with SIPI simulation tools such as Ansys AEDT (HFSS, Q3D), Synopsys Sigrity, ADS, and HSPICE.
- Basic understanding of semiconductor packaging concepts and materials is advantageous.
Housing Allowance:
Eligible interns will receive a housing allowance during their internship.
Equal Employment Opportunity:
SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees, and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws.
Compensation: