Package & Assembly engineering team in US is responsible for delivering robust, reliable, cost-effective package aligned with the end-product requirements. This involves participation in core teams, co-working with other groups in Micron such as Design, Fab, Marketing, Product and Test Engineering, Package Development and Assembly counter-parts and manufacturers in Asia with respect to design, development, qualification and ramp to meet the deliverables  and expectations. 

ESSENTIAL DUTIES AND RESPONSIBILITIES: include the following, other duties may be assigned as necessary.  

Candidates will be responsible for overall Packaging Engineering portfolio presenting it in front of Business Units and Customers while representing package development and assembly groups and OSASTs with respect to package engineering, quality, reliability, capability, cost and capacity.  Thus, candidates will have full responsibility for any aspects of packaging activity in the company representing Package Engineering Group to Business Units and Customers. 

The duties include 

• Technology development:  

• New product scoping and definitions and sometimes with immediate support to BUs, and Customers. 

• Define, develop new package requirements, develop Roadmaps, Scope and include Customer requirements in development roadmap along with schedules. 

• Work well in advance on upcoming fab nodes on new die designs to assure that die can be packaged as required in roadmaps, highlight risks with mitigation plans. 

• Work with internal or external suppliers for assembly process development including equipment development as needed. 

• New product Introduction 

• Plans and develop characterization, qualification plans including BLR for new packages for alignment with margin analysis,  product reliability & customer specifications 

• Identify Risks and Mitigation Plans with new packages based on customer requirements. 

• Using appropriate tools, performs integrity analysis of packages  (includes FMEA, DFX & statistical analysis) 

• Assembly Processes and Materials 

• Prepares and/or updates various packaging & assembly specifications, Bill of Materials and reports if necessary 

• Coordinates with factories worldwide through all product life cycle phases to enable high volume introduction of new packages & assemblies  

• Manage assembly yield improvement reviewing yield loss Pareto analysis 

• Responsible for maintaining package / assembly road map for the product lines supported 

• Extensive knowledge and familiarity with substrate design and substrate manufacturing process, die attach materials (DAF) and Molding compounds  

• Representation 

• Participates in cross-functional teams and ensures that package & assemblies are qualified and introduced into production in a timely manner while meeting all reliability and quality requirements 

• Vendors 

• Working with vendors for materials, processes and equipment for next generation packages. 

• Acts as a liaison while procurement or quality teams work with assembly subcons, substrates and materials vendors 

• Maintains product quality while developing and introducing cost reduction programs 

Specific Role Description: Includes the following but not limited to: 

• Highly functional technical program manager of Package Engineering representing in cross-functional teams 

• Represent Packaging in Business Unit meetings and reviews 

• Guide and technical collaborator to offshore factories, OSATs on package and materials development 

Minimum Qualifications: 

• Masters or PhD graduate in Electrical, Mechanical, Materials Science or Industrial Engineering, with 10-15 years semi-conductor packaging industry experience 

• Demonstrated track record to rapidly analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of the point of diminishing returns 

• Proficient in statistical analysis towards problem solving and the use of Excel and JMP 

• Demonstrated track record to summarize complex data sets for technical and non-technical audiences; elegant in DOE design and execution 

• Highly self-motivated and self-directed with demonstrated ability to work well with people; have strong inter-cultural intuition; have high sense of urgency 

• Demonstrated track record working hands-on around technical equipment and processes (including metrology and semiconductor failure analysis techniques) 

• Strong verbal and written communications skills 

• Ability to multi-task and meet tight deadlines as well as excellent communication and interpersonal skills required 

Desired Skills: 

• Preferred candidate will have worked on projects related to semiconductor packaging 

• Position requires experience in strong technical project Management 

• Extensive knowledge on FMEA, materials analysis, Quality systems, and reliability tests is required 

• Knowledge of 2nd level solder joint reliability and SI/PI is  a plus 

• Understanding of substrate design tools such as APD is a plus 

• Working knowledge of Auto-CAD, Cadence, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques required