Engineer, Process Integration

Posted:
11/30/2023, 4:00:00 PM

Experience Level(s):
Junior ⋅ Mid Level ⋅ Senior

Field(s):
Data & Analytics

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR44444 Engineer, Process Integration

As a process integration engineer in Microns Advanced Packaging Technology Development (APTD) group at Taiwan Taichung, you will be responsible for process development with integration scheme for memory devices application. 

In this position, you will work with process module team, data science team, defect team to develop unit processes that meet product spec and device requirements for HBM products. 

Additionally, real time yield and defect analysis, inline WIP control and escalate for any potential issues are needed. 

 

RESPONSIBILITIES: 

  • Yield and quality improvement for HBM products to support product milestone deliverables. 

  • Develop and lead integration processes from the conceptual phase to high-volume production for highly complex package development challenges. 

  • Work closely with multiple cross functional teams including defect team, probe testing team, and process module team. 

  • Able to work independently along with various projects inside of APTD team. 

 

Basic Qualifications: 

  • Bachelor’s degree in physics, chemistry, electrical engineering, mechanical engineering, material science, or other applied engineering discipline. 

  • Understanding on technical risk assessment, setup mitigation plan, FMEA, and SPC. 

  • Verbal and written communication skills in English 

 

Preferred Qualifications: 

  • Strong focus on advanced package technology (2.5D or 3D package, heterogeneous integration, or fan-out wafer level) research and development. 

  • Depth in packaging technologies such as BGA, fcCSP, WLCSP, SIP, TSV, and SOC. 

  • Hands on experience on flip chip die attach, thermo-compressive bonding, wafer clean, plasma activation. 

  • Understanding on statistical process control and development with structured DOE. 

  • Understanding on various PFA analysis and method 

  • Highly skilled at problem-solving activity and capability of leading cross functional team. 

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at [email protected].

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Micron Technology

Website: https://micron.com/

Headquarter Location: Boise, Idaho, United States

Employee Count: 10001+

Year Founded: 1978

IPO Status: Public

Last Funding Type: Post-IPO Equity

Industries: Computer ⋅ Hardware ⋅ Manufacturing ⋅ Semiconductor