•Responsible for supporting backend process and improvement on assigned packages
•Responsible for quality, yield, cost and process improvement activities.
•Responsible for process documentation, process spec, standard work instruction, OCAP, Lead  etc.
•Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer. 
•Take ownership to work closely with peers and management to drive assigned deliverables

Requirements:
•Candidate must possess at least a Bachelor's Degree in Engineering (Material Science/Electrical/Mechanical or equivalent).
•1-2 years of work experience with semiconductor assembly background for automotive customers (Fresh grads are encouraged to apply)
•Candidate must have great interpersonal skills, leadership skills, positive minded, self-driven and eager to strive for success. 

•Passionate in continuous learning and drive for improvement
•Good SPC, Process Control and other relevant statistical & problem-solving skills
•Good in Microsoft application (PowerPoint, Excel Macro, Word, Auto CAD, etc.). •Project management knowledge is an added advantage. 

More information about NXP in Malaysia...

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