Posted:
2/13/2026, 12:37:16 PM
Location(s):
Phoenix, Arizona, United States ⋅ Arizona, United States
Experience Level(s):
Junior ⋅ Mid Level
Field(s):
Mechanical Engineering
Workplace Type:
On-site
The Experimental Mechanics Lab identifies and solves thermo-mechanical issues in the development of next-generation electronic packaging technology. Lab personnel use a variety of tools to study the behavior of an electronic package and its constituents under different thermo-mechanical boundary conditions, like: dynamic warpage of package using optics-based tools; adhesion strength characterization of various interfaces in a package using Double Cantilever Beam test; fracture toughness measurement of bulk materials using three-point bend test; and CTE measurement using 3D Digital Image Correlation method.
A typical job would involve design of experiment, setup definition including fixture fabrication, sample preparation, data collection and analysis, report presentation, and documentation. Lab engineers also help develop new metrologies to close gaps in lab capabilities when it comes to new packaging technologies.
We are looking for a candidate with a strong background in Experimental Mechanics and they should also possess good problem solving skills and ability to multitask. An ideal candidate would have hands-on lab experience, work well in a team, and have experience with LabView.
Minimum Qualifications:
PhD degree in mechanical engineering, chemical engineering, materials science or a related field
Preferred Qualifications:
Experience in mechanical testing and material characterization
Hands-on experience with test equipment such as:
Load frames, Shadow Moire, nanoindenter, strain gages, digital image correlation, interferometers, DAQs, acoustic emission sensor, accelerometers, etc.
Experience in LabView and MATLAB programming
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $141,910.00-200,340.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Website: https://www.intel.com/
Headquarter Location: Santa Clara, California, United States
Employee Count: 10001+
Year Founded: 1968
IPO Status: Public
Last Funding Type: Post-IPO Equity
Industries: Artificial Intelligence (AI) ⋅ Information Technology ⋅ Product Design ⋅ Semiconductor ⋅ Software