Sr. Manager - Advanced Package Process Development

Posted:
10/6/2024, 12:12:15 PM

Location(s):
Taichung, Taichung City, Taiwan ⋅ Taichung City, Taiwan

Experience Level(s):
Senior

Field(s):
Product

Workplace Type:
Hybrid

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR64149 Sr. Manager - Advanced Package Process Development

Job Summary: Introduction

As a Sr. Assembly Process Development Manager in APTD Micron Taiwan you will be responsible for leading and managing the activities and operation of an Assembly Process Development section by collaborating with internal and external stakeholders to build and execute technology development strategies aligned to organizational and business objectives by providing high performing and cost effective packaging solution on time with best predictable reliability performance. You will need to comprehend package technology development business process (MOR development) and TECHNODE business process for packaging technology and ensure all package development and product transfer work are carried out in accordance with these business processes. You will assist with improving individual capability by conducting performance appraisals with team members to create goals and development plans. You will monitor performance metrics to identify and implement continual improvement opportunities. Other responsibilities include ensuring organizational compliance to company policies and regulations, as well as to departmental procedures, and providing organizational leadership for building and implementing department strategies, processes, and policy through active participation in functional teams and projects, as well as mentoring other functional leaders through collaboration and the development of sustainably successful solutions.

Responsibilities and Duties include, but not limited to:

  • Develop and Communicate Technology Development Strategy
    • Develop and communicate Technology Development strategic objectives.
    • Understand the impact and implications of TD strategy to the overall company strategy and direction.
  • Technical Leadership
    • Set strategic and long-term technical objectives and insure they are aligned with department objectives.
    • Demonstrate understanding of technology complexity and effective technology decision making.
    • Provide technical leadership that may influence company direction.
  • Cross Functional Leadership
    • Represent Assembly team in providing cross team/department leadership in area of responsibility.
    • Work effectively with peers in other team/department to develop and drive cross functional initiatives.
  • Impact and Execution
    • Apply knowledge to achieve quality improvements, cost control, and production efficiency.
    • Ensure accuracy, quality, and timeliness of results.
    • Guide best utilization of resources to achieve end results.
    • Ensure critical deliverables, milestones and goals are met by the team.
    • Provide input to achieve organization objectives and align group to support department objectives.
    • Make decisions that directly impact the achievement of work unit and sub-function objectives.
  • People Leadership Development
    • Mentor, develop and motivate team members.
  • Growth Mindset
    • Continue to build new skills through development goals and learning events.
    • Seek out opportunities to work cross functionally, build a network, and gain competency across domains.

Qualifications and Skills include, but not limited to:

  • At least 10 years experience in packaging industry which should include at least 5years in advanced package field.  
  • Degree/Major: MS or Ph.D in Electrical, Computer Engineering, Chemistry, Physic, Material or related field
  • Proven ability to lead small and large teams toward common goals.
  • Deep knowledge of advanced package process and material development. (2.5D, 3DIC, FO, hybrid bond...etc)
  • Excellent data extraction, analysis and reporting skills. (system data mining, JMP…etc)
  • Understanding of probe, parametric, backend and reliability testing.
  • In-depth understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability.
  • Strong understanding of electronic materials, processing, physical, chemical, and electrical properties, failure analysis, and characterization techniques.
  • Excellent data analysis and data interpretation skills.
  • Proven ability to troubleshoot problems and address root causes.
  • Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.
  • Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.
  • Skill at effectively prioritizing multiple and complex tasks.
  • Good communication skill to align the perspective through cross functional teams
  • Tenacity to work effectively under tight timelines and limited resources
  • Ability to self-direct and measure with minimal supervision.
  • Outstanding communication and presentation skills, written and verbal to all levels of an organization
  • Fluent communication in English

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at [email protected].

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Micron Technology

Website: https://micron.com/

Headquarter Location: Boise, Idaho, United States

Employee Count: 10001+

Year Founded: 1978

IPO Status: Public

Last Funding Type: Post-IPO Equity

Industries: Computer ⋅ Hardware ⋅ Manufacturing ⋅ Semiconductor