Job Description:
This position is a packaging front-end R&D intern, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global team to finish development projects and other tasks as listed below:

• New packaging technology development
• New package related process development
• Advanced material interface study
• Advanced IC package failure analysis
• Coordinate/lead development project independently
• Communication/cooperation among global teams (US/Europe/Malaysia/Japan/France/etc.)

Qualification:

• Pursuing in bachelor or master degree.
• Major on: Metallic Materials Engineering; Polymer Materials Engineering; Mechanical Engineering and Automation.
• Good communication of oral and written English.

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