Posted:
5/12/2026, 5:00:00 PM
Location(s):
Bangkok, Thailand
Experience Level(s):
Expert or higher ⋅ Senior
Field(s):
Product
Role Summary
• This role is responsible for driving cost competitiveness, process efficiency and BOM competitiveness across NXP’s assembly operations. This role leads strategic initiatives to achieve breakthrough cost reductions, enhance manufacturing efficiency, and enable next-generation package architectures in close collaboration with suppliers, material innovation and Business Lines (BL).Job Responsibility
1.Package Cost Transformation Leadership
2.Operation Process Innovation
3.People Management and Program Management
4.Strategic Supplier Engagement
5.Business Line (BL) & Stakeholder Management
6.Change Management & Governance
Job Qualification
• Bachelor’s or Master’s degree in Electronics, Electrical, Mechanical, Materials Engineering, or a related field.
• 10–18+ years in semiconductor assembly / packaging engineering
• Proven leadership in:
Cost reduction and value engineering programs
QFN back end, in strip solutions and leadframe-based package technologies
Strong track record in Driving cross-site or global initiatives & Supplier collaboration and negotiation
• Technical Expertise
Deep knowledge of Assembly processes especially Back end Leadframe design and high-density packaging
Cost modeling (BOM + process cost structures)
Experience in Molding process optimization
Familiarity with PCN processes, JEDEC standards, and qualification flows
• Leadership & Competencies
Strategic thinker with strong cost engineering mindset
Influential leader capable of driving alignment across BLs and suppliers
Strong analytical and problem-solving capability
Proven ability to lead change in complex, matrix organizations
Excellent communication skills with executive-level stakeholder management
Website: https://www.nxp.com/
Headquarter Location: Eindhoven, Noord-Brabant, The Netherlands
Employee Count: 10001+
Year Founded: 2006
IPO Status: Public
Last Funding Type: Post-IPO Debt
Industries: Apps ⋅ Automotive ⋅ Energy Efficiency ⋅ Information Technology ⋅ Manufacturing ⋅ Mobile ⋅ News ⋅ Semiconductor ⋅ Software ⋅ Video