Job Details:

Job Description: 

We are seeking a highly skilled and motivated Advanced Packaging and Technology Manufacturing Engineer to join our dynamic team.

This role will focus on supporting advanced packaging technologies including Embedded Interconnect Bridge (EmIB), Foveros, High Bandwidth Interconnect (HBI), substrates, and assembly processes. The successful candidate will play a critical role in driving process development efforts through first principles modeling, frequent calibration to empirical and experimental data, and collaborative problem-solving across multiple partner organizations.

Key Responsibilities:

• Develop and apply first principles models to support and optimize advanced packaging manufacturing processes.

• Perform regular calibration and validation of models with empirical and experimental data to ensure accuracy and applicability.

• Partner with cross-functional teams and external organizations to translate abstract challenges into well-defined problem statements and actionable solutions.

• Utilize deep understanding of wafer fabrication processes including electrodeposition, bumping, thin films, planarization, and singulation.

• Simulate manufacturing processes and leverage results to troubleshoot and solve real-world production issues.

• Communicate technical progress, challenges, and recommendations effectively with both technical and non-technical stakeholders.

• Support continuous improvement initiatives and implementation of new technologies in packaging manufacturing.

The ideal candidate should exhibit the following behavioral traits/skills:

• Strong problem-solving mindset and analytical capabilities.

• Ability to adapt quickly to changing project requirements and priorities.

• Strong interpersonal and soft skills to foster effective collaboration in a multidisciplinary environment.

• Experience working collaboratively with multiple teams to define and solve complex process challenges.

• Excellent technical communication skills, with the ability to explain complex concepts clearly and succinctly.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Master's degree in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or a related technical field with 10+ years of relevant experience

• PhD in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or a related technical field with 7+ years of relevant experience

Relevant Experience in:

• Advanced packaging technologies such as EmIB, Foveros, HBI, substrates, and assembly.

• Wafer fabrication techniques (electrodeposition, bumping, thin films, planarization, singulation).

• Expertise in process simulation and modeling with frequent calibration against experimental data.

Preferred Qualifications:

• Experience with semiconductor manufacturing environments and terminology.

• Hands-on Experience with experimental design and data acquisition methods.

• Experience with relevant simulation tools and data analysis software is a plus

• Previous related work experience in a semiconductor foundry preferred 

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

US, Arizona, Phoenix

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.  Find more information about all of our Amazing Benefits here:

https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003

Annual Salary Range for jobs which could be performed in the US:

$177,200.00-$250,160.00

Salary range dependent on a number of factors including location and experience.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.