Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Are you enthusiastic about semiconductor package design and would you enjoy being part of a global team of experts? Then apply for the Senior Package Design Engineer position in the Global Design, Simulation, and Substrate team at Micron Technology.

You will collaborate with global multi-functional teams to provide innovative DRAM package design solutions for various applications such as Mobile, Edge/Cloud Computing, Automotive, Artificial Intelligence, and Data Center.

Deliver design activities on time and ensure that design outputs meet Assembly and vendor specifications for High Volume Manufacturing (HVM).
Join global multi-functional teams, including internal assembly sites, and external subcontractors, to deliver package designs optimized for requirements such as electrical (signal and power integrity), mechanical (warpage, package strength), thermal, and reliability requirements for high-speed interfaces. The results include substrate design databases, package stack-up, routing studies, substrate layout, wire bond diagrams, simulation, and other design documentation.
Collaborate with engineering teams--Technology Development (TD), Package Architecture, and key customers in defining next generation packaging solutions and recommend design rules and capability advancements required to productize solutions as roadmap offerings.

Responsibilities include, but are not limited to the following:

• Support die padlog layout/optimization.
• Support design of highly integrated packages using advanced BEOL and RDL flows for optimal electrical performance, manufacturability, and reliability. Work with customers, internal process design teams, OSATs, and other ecosystem partners.
• Support set up of designs, rules, and routing methodologies for advanced processes.
• Support package and DFMEA reviews with assembly engineering and subcon teams.
• Generate and update assembly documents in database. Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings.
• Work with SBT (Printed Circuit Board) suppliers, OSATs (Outsourced Semiconductor Assembly and Test), and other ecosystem partners to meet their requirements with packaging solutions.
• Work closely with architects, semiconductor design leads and package design leads from the initial stages of chip development to optimize die floorplan, interconnection scheme, and package designs for the best system performance.
• Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.
• Lead package and DFM (Design for Manufacturing) reviews and design setup.
• Engage with key Business Unit (BU) customers and assembly subcontractor partners to propose package solutions that meet customer and/or market needs.
• Support package technology development, including material selection, process development, DOEs (Design of Experiments), and related activities.
• Track and drive program landmarks to ensure timely development execution.
• Support packaging IP (Intellectual Property) development.
• Provide design support for thermal/mechanical/electrical simulation analysis.
• Support and supply to the design group’s continuous improvement efforts such as:
  • Global design alignment activities
  • Package design rules and system development
  • Package roadmaps
  • Competitive Analysis review

Qualifications

• A master's or doctorate in electrical engineering (preferred) or a related field that covers a wide range of topics in mechanical engineering, materials science, or other interdisciplinary areas.
• Five or more years (preferably 10+ years) of industry experience within the following areas:
  • Advanced Memory Substrate Design for flip chip and wire bond interconnects
  • Design optimization for Signal and Power Integrity
  • Cadence® (Allegro® Package Designer+), OrbitIO/Integrity System Planner, or Siemens/MentorGraphics (Xpedition tool suite)
  • AutoCAD (Autodesk Mechanical) tools
  • Assembly Process/Materials
  • Assembly DOE (Design of Experiments) definition/management
  • Chip Package Interaction (CPI)
• Outstanding computer skills and MS Office competence.
• A keen eye for detail and accuracy.
• Effective interpersonal skills, both oral and written.
• A global perspective and the ability to work in a multicultural environment.
• Ability to prioritize and manage numerous projects successfully.
• Willingness to travel as needed.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at  [email protected] or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.