Semiconductor Package Competitive Analysis Intern

Posted:
7/14/2026, 11:16:02 AM

Location(s):
Kuala Lumpur, Malaysia

Experience Level(s):
Internship

Field(s):
Data & Analytics

Workplace Type:
On-site

Competitive Analysis Intern – Package Innovation

Role Summary
Support the Package Innovation (PI) team in building competitive intelligence through structured analysis of semiconductor packaging technologies, market trends, and competitor activities.

Key Responsibilities

  • Perform structured data mining of competitor product releases, PCNs, teardown reports, and technology announcements
  • Develop insights on packaging trends, cost/performance positioning, and technology differentiation
  • Conduct startup and emerging technology evaluations relevant to advanced packaging
  • Consolidate findings into clear, executive-ready reports and dashboards for PI leadership
  • Maintain and enhance competitive analysis databases and tracking frameworks

Additional Exposure

  • Participate in ATKL manufacturing projects to gain foundational understanding of semiconductor assembly processes

Qualifications

  • Degree candidate in Materials Science, Mechanical, Electrical Engineering, or related field
  • Strong analytical mindset with ability to synthesize large datasets into actionable insights
  • Proficient in Excel and PowerPoint; data analysis or visualization experience preferred
  • Familiarity with AI tools and advanced search techniques for efficient data mining is highly desired
  • Strong communication skills with ability to clearly present findings


More information about NXP in Malaysia...

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NXP Semiconductors

Website: https://www.nxp.com/

Headquarter Location: Eindhoven, Noord-Brabant, The Netherlands

Employee Count: 10001+

Year Founded: 2006

IPO Status: Public

Last Funding Type: Post-IPO Debt

Industries: Apps ⋅ Automotive ⋅ Energy Efficiency ⋅ Information Technology ⋅ Manufacturing ⋅ Mobile ⋅ News ⋅ Semiconductor ⋅ Software ⋅ Video

Visa Sponsorship: Sponsors work visas