Posted:
7/14/2026, 11:16:02 AM
Location(s):
Kuala Lumpur, Malaysia
Experience Level(s):
Internship
Field(s):
Data & Analytics
Workplace Type:
On-site
Role Summary
Support the Package Innovation (PI) team in building competitive intelligence through structured analysis of semiconductor packaging technologies, market trends, and competitor activities.
Key Responsibilities
Additional Exposure
Qualifications
Website: https://www.nxp.com/
Headquarter Location: Eindhoven, Noord-Brabant, The Netherlands
Employee Count: 10001+
Year Founded: 2006
IPO Status: Public
Last Funding Type: Post-IPO Debt
Industries: Apps ⋅ Automotive ⋅ Energy Efficiency ⋅ Information Technology ⋅ Manufacturing ⋅ Mobile ⋅ News ⋅ Semiconductor ⋅ Software ⋅ Video
Visa Sponsorship: Sponsors work visas