Posted:
8/9/2026, 8:03:08 PM
Location(s):
Kedah, Malaysia
Experience Level(s):
Junior ⋅ Mid Level
Field(s):
Mechanical Engineering
Workplace Type:
On-site
Pay:
$87k–$207k/yr
The Role and Impact
Join our team as a Module Engineer, where you will play a vital role in enabling the mass production of advanced integrated circuits. In this role, you will own and optimize high-volume manufacturing equipment and processes to ensure precision, efficiency, and quality. Your work will directly impact Intel's ability to deliver cutting-edge technology while fostering opportunities to grow your technical expertise in a fast-paced, innovative environment.
Business group
The Assembly and Test Manufacturing (ATM) organization is an essential part of Intel's back-end manufacturing network, supporting Intel's IDM 2.0 strategy. ATM delivers differentiated solutions across a broad product portfolio, serving client, automotive, server, and connectivity segments. As part of this team, you'll contribute to Intel's success by driving manufacturing excellence and supporting the global transfer of cutting-edge technologies.
Key Responsibilities
Minimum Qualifications
Preferred Qualifications
Take this opportunity to be part of Intel's innovative team. Shape the future of semiconductor manufacturing and contribute to breakthroughs in technology.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Website: https://www.intel.com/
Headquarter Location: Santa Clara, California, United States
Employee Count: 10001+
Year Founded: 1968
IPO Status: Public
Last Funding Type: Post-IPO Equity
Industries: Artificial Intelligence (AI) ⋅ Information Technology ⋅ Product Design ⋅ Semiconductor ⋅ Software
Visa Sponsorship: Sponsors work visas