Primary Responsibilities: 

• Support daily production of die sort by doing yield analysis, lot disposition, production issue trouble-shooting, etc

• Conduct 6 sigma or quick-win project to improve product yield, quality and drive cost reduction

• Lead investigation of customer claim, work with multi-functional team for case closure with 8D approach

• Coach and lead shift technician to work on daily production issue, engineering data collection, support production pack-out, etc

• Handle communication with wafer Fab site, sister sites, cooperate production engineering/QA to support production yield/quality issues, new production introduction, etc

• Other tasks assigned by supervisor/manager to support business need

Requirements:

• University degree and above

• 5+ years working experience in semiconductor including 3+ years direct working experience in die sort or final test.

• Be familiar with EG4090 or UF2000 prober system.

• Hands-on experience of ETS200T/ETS88 or other comparable test platform.

• Good English skills including reading, writing, ability to handle communication with English speakers.

• Team players, good communication skill with strong ownership.

• Education: Bachelor holder in EE, microelectronics, communication or related majority, college graduator with good working experience will also be considered.