Posted:
2/1/2026, 11:20:44 PM
Location(s):
Haifa District, Israel ⋅ Petah Tikva, Center District, Israel ⋅ Haifa, Haifa District, Israel ⋅ Center District, Israel
Experience Level(s):
Mid Level
Field(s):
Software Engineering
Workplace Type:
On-site
Join Intel’s Wireless Connectivity Solutions Group as a System Modeling & Specification MSc Student and help shape the next generation of Wi‑Fi and Bluetooth SoCs. In this role, you will develop system‑level models for advanced analog and mixed‑signal blocks, explore architectural tradeoffs through simulation and research, and contribute to early specification definition. You will work closely with leading architects and designers while leveraging AI‑assisted tools to accelerate analysis, modeling, and technical exploration—gaining hands‑on experience at the intersection of circuits, systems, and intelligent workflows.
System Modeling & Specification Student (MSc)
Intel Wireless Connectivity Solutions Group – Circuit/System Team
Intel’s Wireless Connectivity Solutions Group delivers industry‑leading Wi‑Fi and Bluetooth products across the PC ecosystem. The Circuit/System team is responsible for defining and architecting the analog, power delivery, and high‑speed SerDes building blocks that form the foundation of Intel’s next‑generation wireless SoCs.
We are seeking a highly motivated Master’s student to support system‑level modeling and specification definition of advanced analog and mixed‑signal components. This role is ideal for a curious and analytical student who enjoys deep technical research, system thinking, and early architectural influence, and who is interested in applying AI‑assisted workflows as part of modern engineering practice.
Key Responsibilities
Nice to Have
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
Website: https://www.intel.com/
Headquarter Location: Santa Clara, California, United States
Employee Count: 10001+
Year Founded: 1968
IPO Status: Public
Last Funding Type: Post-IPO Equity
Industries: Artificial Intelligence (AI) ⋅ Information Technology ⋅ Product Design ⋅ Semiconductor ⋅ Software