Posted:
3/23/2026, 3:53:57 AM
Location(s):
California, United States ⋅ Hillsboro, Oregon, United States ⋅ Oregon, United States ⋅ Santa Clara, California, United States ⋅ Phoenix, Arizona, United States ⋅ Folsom, California, United States ⋅ Arizona, United States
Experience Level(s):
Senior
Field(s):
Mechanical Engineering
Workplace Type:
Hybrid
The Role and Impact:
The Customer Enabling Engineer is responsible for developing and executing strategies that promote Intel Foundry's Advanced Packaging solutions to customers. This role involves engaging with customers to understand their needs and ensuring end to end ownership of technical engagement. Some of the key responsibilities includes
• Be the center point of contact for all technical collaboration with the customer, that includes but not limited to Critical to Function Data, Schedule, demand/sample size, reliability requirements, certification, NPI and 1st Silicon coordination with customer etc.
• Collaborate with Customer Packaging team to translate product requirements into package architecture specification, co-define test vehicle and product strategy and manage the schedule, cycle time negotiation.
• Participate in technology tradeoff decisions ensuring packages conform to electrical, mechanical, thermal, and reliability standards, specifications, and landing zones.
• Translate the requirements to the internal execution teams and manage customer dashboards via performance against execution (PAS)
• Collaborate with silicon and package execution leads to ensure high quality outcomes and aids in removing roadblocks.
• Participate and contribute in identifying critical technology solutions for future product needs.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
OR
OR
Experience listed above should be a combination of the following:
• Advanced Packaging Processing, fabrication including process flows, FMEA, PADK and Design rules
• Product Life Cycle and Packaging Reliability Basics
• Program Management including proficiency with Microsoft Project and Model based problem Solving
Preferred Qualifications:
8+ years of experience in the areas below:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $180,770.00-219,550.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Website: https://www.intel.com/
Headquarter Location: Santa Clara, California, United States
Employee Count: 10001+
Year Founded: 1968
IPO Status: Public
Last Funding Type: Post-IPO Equity
Industries: Artificial Intelligence (AI) ⋅ Information Technology ⋅ Product Design ⋅ Semiconductor ⋅ Software