Manufacturing Line Manager

Posted:
9/1/2026, 2:06:46 AM

Location(s):
Kaohsiung, Taiwan

Experience Level(s):
Senior

Field(s):
Operations & Logistics

Workplace Type:
On-site

Pay:
$83k–$90k/yr

Key Responsibilities

  • Lead Chip Sort and T&R manufacturing operations to achieve business objectives through effective capacity management, productivity enhancement, and organizational leadership.
  • Lead and develop a cross-functional manufacturing organization of 70-80 employees across Process, Equipment, and Production teams, ensuring strong execution, talent development, workforce engagement, and achievement of operational targets.
  • Drive SQCDP performance and operational excellence through effective cross-functional collaboration, manufacturing performance improvement, and disciplined execution.
  • Lead continuous improvement initiatives utilizing GEMBA, SGA, Lean Manufacturing, and PDCA methodologies to enhance productivity, quality, and operational efficiency.
  • Collaborate with Engineering, Quality, Planning, IE, and Global User Groups to ensure production stability, rapid issue resolution, and successful NPI implementation.
  • Develop organizational capability through talent development, succession planning, employee engagement, and leadership coaching.

Preferred Qualifications

  • Bachelor’s degree or above in Engineering or a related discipline.
  • 8+ years of semiconductor manufacturing experience with progressive leadership responsibilities.
  • Broad manufacturing management experience in Chip Sort, T&R, Assembly, or related semiconductor operations.
  • Demonstrated success in driving operational excellence, productivity improvement, capacity optimization, and business results.
  • Strong leadership, organizational development, communication, and stakeholder management capabilities.
  • Good command of English.


More information about NXP in Greater China...

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NXP Semiconductors

Website: https://www.nxp.com/

Headquarter Location: Eindhoven, Noord-Brabant, The Netherlands

Employee Count: 10001+

Year Founded: 2006

IPO Status: Public

Last Funding Type: Post-IPO Debt

Industries: Apps ⋅ Automotive ⋅ Energy Efficiency ⋅ Information Technology ⋅ Manufacturing ⋅ Mobile ⋅ News ⋅ Semiconductor ⋅ Software ⋅ Video

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